Telecommunication Industry: Articles

CALCE EPSC faculty and research staff have collectively authored over 25 internationally acclaimed textbooks and well over 400 research publications relevant to achieving quality and sustainability of electronic systems. To access a comprehensive list of CALCE publications, click here. The sublist of these publications that is of particular importance and interest to the telecommunication industry is presented below.'

  • The Concurrent Operators Method Applied to Two-Dimensional Time-Harmonic Radiation and Scattering Problems, V. Chebolu, X. Wu and O. Ramahi, IEEE Transactions Antennas Propagation, to be published in 2003.
  • A Simple Finite-Difference Frequency-Domain (FDFD) Algorithm for Analysis of Switching Noise in Printed Circuit Boards and Packages, V. Subramanian B. Archambeault and O. Ramahi, IEEE Transactions on Advanced Packaging, to be published in 2003.
  • Factors Dominating Corrosion of Zinc-Coated Steel Enclosures for Electromagnetic Shielding, J. Xie, M. Pecht, and O. Ramahi, IEEE Trans. Components Manufacturing and Packaging Technology, to be published in 2003. 
  • Surface Finish Effects on High-Speed Interconnects, X. Wu, M. Ramahi, G. Brist and D. Cullen, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
  • Wire Flexure Fatigue Model for Asymmetric Bond Height, K. Meyyappan, P. Hansen and P. McCluskey, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
  • Design Guidelines for Preventing Flex Cracking Failures in Ceramic Capacitors, N. Blattau, D. Barker, C. Hillman, 2003 Proceedings - 23rd Capacitor and Resistor Technology Symposium, pp. 155-162, Scottsdale, AZ, March 31 - April 3, 2003.
  • Failure Analysis of Electrostatic Discharge and Electrical Overstress Failures of GaAs MMIC, Y. Hwang, M. Lee and M. Pecht, IMAPS Advanced Technology Conference on 3-D Packaging, pp. 1-5, Baltimore, MD, March 11-13, 2003.
  • Field Failure due to Creep Corrosion on Components with Palladium Pre-plated Leadframes, P. Zhao and M. Pecht, Microelectronics Reliability, Vol. 43, No. 5, pp. 775-778, 2003.
  • A Novel Power Plane With Integrated Simultaneous Switching Noise Mitigation Capability Using High Impedance Surface, T. Kamgaing and O. Ramahi, IEEE Microwave and Wireless Components Letters, Vol. 13, No. 1, pp. 21-23, January 2003.
  • Concurrent Complementary Operators for Mesh Truncation in Frequency-Domain Simulations, O. Ramahi, IEEE Microwave and Wireless Components Letters, Vol. 12, No. 3, pp. 99-101, March 2002.
  • Design Guidelines for Avoiding Flex Crac king in Ceramic Capacitors, C. Hillman, N. Blattau, and D. Barker, Pr oceedings of the National Electronic Packaging and Production Conference (NEPCON -West), CA version pp. 318-326, San Jose, CA, December 2002.
  • Using Electronic Parts Outside the Manufacturer's Specified Temperature Range, M. Pecht, D. Das, and R. Biagini, Proceedings of The 3rd International Conference on Quality and Reliability, pp. 182-192, Australia, August 28-30, 2002.
  • Thermomechanical Durability of High I/O BGA Packages, P. Davuluri, S. Shetty, A. Dasgupta and S. Young, Transactions of the ASME, Vol. 124, pp. 226-270, September 2002.
  • Application of the Concurrent Complementary Operators Method to Numerically-Derived Absorbing Boundary Conditions, X. Wu and O. Ramahi, Microwave and Optical Technology Letters, Vol. 32, No. 4, pp. 272-275, February, 2002.
  • Analysis and Reduction of Electromagnetic Field Leakage through Loaded Apertures, L. Li and O. Ramahi, IEEE Antennas and Propagation Society/URSI International Symposium. San Antonin, TX, June 16-21, 2002.
  • Calculation and Mitigation of Power Plane Resonance in Printed Circuit Boards (PCB), V. Subramanian and O. Ramahi, In Proc. IEEE Antennas and Propagation Society/URSI International Symposium, San Antonio, TX, June 16-21, 2002.
  • A New Test/Diagnosis/Rework Model for Use in Technical Cost Modeling of Electronic Systems Assembly, T. Trichy, P. Sandborn, and S. Sahasrabudhe, to be published, International Test Conference, Baltimore, MD, 2002. 
  • Electrical Characterization of Lead-Free Solder Separable Contact Interfaces, J. Wu, M. Pecht, and R. Mroczkowski, Pan Pacific Microelectronics Symposium, pp. 125-130, Maui, Hawaii, February 5-7, 2002. 
  • Using PEEC and FDTD to Solve the Challenge Delay Line Problem, B. Archambeault, A. Roden and O. Ramahi, IEEE International Symposium on Electromagnetic Compatibility, Montreal, Canada, Aug. 13-17, 2001. 
  • Full-Wave Analysis of Delay Lines, O. Ramahi, and B. Archambeault, 14th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, Zurich, Switzerland, Feb. 20-22, 2001. 
  • Phased-Array Radar for Breast Cancer Detection, O. Ramahi, T. Thakker, S. Trabelsi, and R. Russell, IEEE Antennas and Propagation Society International Symposium, Boston, MA, July 8-13, 2001. 
  • Prediction of Shielding Degradation Arising from Variation in Contact Impedance of Inter-metallic Junctions, L. Li and O. Ramahi, IEEE Antennas and Propagation Society International Symposium, Boston, MA, July 8-13, 2001
  • Manufacturer Assessment Procedure and Criteria for Parts Selection and Management, T. Syrus, M. Pecht, and R. Uppalapati, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 351-358, October 2001. 
  • Fundamental Reliability Issues Associated with A Commercial Particle-in-Elastomer Interconnection System, W. Liu, M. Pecht and J. Xie, IEEE Transactions on Components and Packaging Technologies, Volume 24, No. 3, pp. 520-525, September, 2001
  • Reliability Engineering in the 21st Century - A Focus on Predicting the Reliability of Electronic Products and Systems, M. Pecht, Proceedings of The 5th ICRMS 2001, Vol. 1, pp. 1-19, 28-31, August, 2001, Dalian, China. 
  • Hollow Fibers can Accelerate Conductive Filament Formation, M. Pecht, K. Rogers and C. Hillman, ASM International Practical Failure Analysis, pp. 57-60, Vol. 1, Issue 4, August 2001. 
  • We STILL have a headache with Arrhenius, M. Osterman, Electronics Cooling, Vol. 7, No. 1, pp 53-54, February 2001
  • Palladium-plated Packages: Creep Corrosion and Its Impact on Reliability, J. Xie and M. Pecht, Advanced Packaging, pp. 39-42, February 2001
  • Development and Activities of the IEEE Reliability Standards Group, M. Pecht and A. Ramakrishnan, Journal of the Reliability Engineering Association of Japan, Vol. 22, No. 8, pp. 699-706, November 2000. 
  • Effects and Interactions of Design Parameters for Gold-Plated Electric Contacts, R. Martens and M. Pecht, Journal of Materials Science: Materials in Electronics , Vol. 11, pp. 209-218, May 2000. 
  • Equipment Supplier Intervention Techniques, C. A. Schwach, A. Mathur, R. Solomon, P. Sandborn, and M. Pecht, Future EMS International, No. 3, pp. 97-100, 2000. 
  • Numerical and Experimental Thermal Characterization of a Liquid Cooled AlSiC Power Electronics Base Plate with Integral Pin Fins, K. Moores, Y. Joshi and G. Schiroky, ITHERM 2000 Proceedings, Vol. 2. pp. 385-390, May 2000
  • Effect of Corrosion on the Transfer Impedance of Zinc-Coated Steel Enclosures, J. Xie, M. Pecht, D. Barbe, S. Das, J. Nuebel and B. Zand, IEEE Transactions on Electromagnetic Compatibility, Vol. 42, No. 1, pp. 71-76, February 2000.
  • Corrosion of a Zinc-coated Steel Enclosure at the Contact Interfaces of Gasket Joints, J. Xie, M. Pecht, S. Das, J. Nuebel and B. Zand, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 136-142, March 2000.
  • Assessing the Operating Reliability of LGA Elastomer Sockets, J. Xie, C. Hillman, P. Sandborn, M. Pecht, A. Hassanzadeh and D. DeDonato, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 171-176, March 2000.
  • The Electronic Part Life Cycle, M. Pecht and D. Das, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 190-193, March 2000.