Telecommunication Industry:
Articles
CALCE EPSC faculty and research staff have collectively
authored
over 25 internationally acclaimed textbooks and well over 400
research publications relevant to achieving quality and
sustainability of electronic systems. To access a
comprehensive list
of CALCE publications, click here. The sublist of these
publications
that is of particular importance and interest to the
telecommunication industry is presented below.'
The
Concurrent Operators Method Applied to Two-Dimensional
Time-Harmonic Radiation and Scattering Problems, V. Chebolu, X.
Wu and O. Ramahi, IEEE Transactions Antennas Propagation, to be
published in 2003.
A
Simple Finite-Difference Frequency-Domain (FDFD) Algorithm for
Analysis of Switching Noise in Printed Circuit Boards and
Packages, V. Subramanian B. Archambeault and O. Ramahi, IEEE
Transactions on Advanced Packaging, to be published in 2003.
Factors
Dominating Corrosion of Zinc-Coated Steel Enclosures for
Electromagnetic Shielding, J. Xie, M. Pecht, and O. Ramahi, IEEE
Trans. Components Manufacturing and Packaging Technology, to be
published in 2003.
Surface
Finish Effects on High-Speed Interconnects, X. Wu, M. Ramahi, G.
Brist and D. Cullen, Proceedings of IPACK 03: International
Electronic Packaging Technical Conference and Exhibition, July
6-11, 2003, Maui, Hawaii, USA.
Wire
Flexure Fatigue Model for Asymmetric Bond Height, K. Meyyappan,
P. Hansen and P. McCluskey, Proceedings of IPACK 03:
International Electronic Packaging Technical Conference and
Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
Design
Guidelines for Preventing Flex Cracking Failures in Ceramic
Capacitors, N. Blattau, D. Barker, C. Hillman, 2003 Proceedings
- 23rd Capacitor and Resistor Technology Symposium, pp. 155-162,
Scottsdale, AZ, March 31 - April 3, 2003.
Failure
Analysis of Electrostatic Discharge and Electrical Overstress
Failures of GaAs MMIC, Y. Hwang, M. Lee and M. Pecht, IMAPS
Advanced Technology Conference on 3-D Packaging, pp. 1-5,
Baltimore, MD, March 11-13, 2003.
Field
Failure due to Creep Corrosion on Components with Palladium
Pre-plated Leadframes, P. Zhao and M. Pecht, Microelectronics
Reliability, Vol. 43, No. 5, pp. 775-778, 2003.
A
Novel Power Plane With Integrated Simultaneous Switching Noise
Mitigation Capability Using High Impedance Surface, T. Kamgaing
and O. Ramahi, IEEE Microwave and Wireless Components Letters,
Vol. 13, No. 1, pp. 21-23, January 2003.
Concurrent
Complementary Operators for Mesh Truncation in Frequency-Domain
Simulations, O. Ramahi, IEEE Microwave and Wireless Components
Letters, Vol. 12, No. 3, pp. 99-101, March 2002.
Design
Guidelines for Avoiding Flex Crac king in Ceramic Capacitors, C.
Hillman, N. Blattau, and D. Barker, Pr oceedings of the National
Electronic Packaging and Production Conference (NEPCON -West),
CA version pp. 318-326, San Jose, CA, December 2002.
Using
Electronic Parts Outside the Manufacturer's Specified
Temperature Range, M. Pecht, D. Das, and R. Biagini, Proceedings
of The 3rd International Conference on Quality and
Reliability, pp. 182-192, Australia, August 28-30, 2002.
Thermomechanical
Durability of High I/O BGA Packages, P. Davuluri, S. Shetty, A.
Dasgupta and S. Young, Transactions of the ASME, Vol. 124, pp.
226-270, September 2002.
Application
of the Concurrent Complementary Operators Method to
Numerically-Derived Absorbing Boundary Conditions, X. Wu and O.
Ramahi, Microwave and Optical Technology Letters, Vol. 32, No.
4, pp. 272-275, February, 2002.
Analysis
and Reduction of Electromagnetic Field Leakage through Loaded
Apertures, L. Li and O. Ramahi, IEEE Antennas and Propagation
Society/URSI International Symposium. San Antonin, TX, June
16-21, 2002.
Calculation
and Mitigation of Power Plane Resonance in Printed Circuit
Boards (PCB), V. Subramanian and O. Ramahi, In Proc. IEEE
Antennas and Propagation Society/URSI International Symposium,
San Antonio, TX, June 16-21, 2002.
A
New Test/Diagnosis/Rework Model for Use in Technical Cost Modeling of
Electronic Systems Assembly, T.
Trichy, P. Sandborn, and S. Sahasrabudhe, to be published,
International Test Conference, Baltimore, MD, 2002.
Electrical
Characterization of Lead-Free Solder Separable Contact Interfaces, J. Wu,
M.
Pecht, and R. Mroczkowski, Pan Pacific Microelectronics
Symposium, pp. 125-130, Maui, Hawaii, February 5-7, 2002.
Using
PEEC and FDTD to Solve the Challenge Delay Line Problem, B.
Archambeault, A. Roden and O. Ramahi, IEEE International
Symposium on Electromagnetic Compatibility, Montreal, Canada, Aug. 13-17,
2001.
Full-Wave
Analysis of Delay Lines, O.
Ramahi, and B. Archambeault, 14th International Zurich
Symposium and Technical Exhibition on Electromagnetic Compatibility,
Zurich, Switzerland, Feb. 20-22, 2001.
Phased-Array
Radar for Breast Cancer Detection, O.
Ramahi, T. Thakker, S. Trabelsi, and R. Russell, IEEE
Antennas and Propagation Society International Symposium, Boston, MA, July
8-13, 2001.
Prediction
of Shielding Degradation Arising from Variation in Contact Impedance of
Inter-metallic Junctions, L. Li and O.
Ramahi, IEEE Antennas and Propagation Society
International Symposium, Boston, MA, July 8-13, 2001
Manufacturer
Assessment Procedure and Criteria for Parts Selection and Management, T.
Syrus, M. Pecht, and R. Uppalapati, IEEE Transactions on
Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 351-358, October
2001.
Fundamental
Reliability Issues Associated with A Commercial
Particle-in-Elastomer Interconnection System, W. Liu,
M. Pecht and J.
Xie, IEEE Transactions on Components and Packaging
Technologies, Volume 24, No. 3, pp. 520-525, September, 2001
Reliability
Engineering in the 21st Century - A Focus on Predicting the Reliability of
Electronic Products and Systems, M.
Pecht, Proceedings of The 5th ICRMS 2001, Vol. 1,
pp. 1-19, 28-31, August, 2001,
Dalian, China.
Hollow
Fibers can Accelerate Conductive Filament Formation, M.
Pecht, K. Rogers and C. Hillman, ASM International
Practical Failure Analysis, pp. 57-60, Vol. 1, Issue 4, August
2001.
We
STILL have a headache with
Arrhenius, M. Osterman, Electronics Cooling, Vol. 7,
No. 1, pp 53-54, February 2001
Palladium-plated
Packages: Creep Corrosion and Its Impact on Reliability, J. Xie and M.
Pecht, Advanced Packaging, pp. 39-42, February
2001
Development
and Activities of the IEEE Reliability Standards Group, M. Pecht and A.
Ramakrishnan, Journal of the Reliability Engineering
Association of Japan, Vol. 22, No. 8, pp. 699-706, November
2000.
Effects
and Interactions of Design Parameters for Gold-Plated Electric Contacts,
R. Martens and M.
Pecht, Journal of Materials Science: Materials in
Electronics , Vol. 11, pp. 209-218, May 2000.
Equipment
Supplier Intervention Techniques, C. A.
Schwach, A. Mathur, R. Solomon, P. Sandborn, and M. Pecht,
Future EMS International, No. 3, pp. 97-100, 2000.
Numerical
and Experimental Thermal Characterization of a Liquid Cooled AlSiC Power
Electronics Base Plate with Integral Pin Fins, K.
Moores, Y. Joshi and G. Schiroky, ITHERM 2000 Proceedings,
Vol. 2. pp. 385-390, May 2000
Effect
of Corrosion on the Transfer Impedance of Zinc-Coated Steel Enclosures, J.
Xie, M. Pecht, D. Barbe, S. Das, J. Nuebel and B. Zand,
IEEE Transactions on Electromagnetic Compatibility, Vol. 42, No. 1,
pp. 71-76, February 2000.
Corrosion
of a Zinc-coated Steel Enclosure at the Contact Interfaces of Gasket
Joints, J.
Xie, M. Pecht, S. Das, J. Nuebel and B. Zand, IEEE
Transactions on Components and Packaging Technologies, Vol. 23, No. 1,
pp. 136-142, March 2000.
Assessing
the Operating Reliability of LGA Elastomer Sockets, J.
Xie, C. Hillman, P. Sandborn, M. Pecht, A. Hassanzadeh and
D.
DeDonato, IEEE Transactions on Components and Packaging
Technologies, Vol. 23, No. 1, pp. 171-176, March 2000.
The
Electronic Part Life Cycle, M. Pecht and D. Das, IEEE Transactions on
Components and Packaging Technologies, Vol. 23, No. 1, pp. 190-193, March
2000.
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