CALCE Web Seminars
Rapid advances in electronic products and systems require special efforts to educate the technical workforce. These special efforts include the use of systematic just-in-time transfer of state-of-the-art knowledge derived from the latest research results.
To meet these challenges, the Center for Advanced Life Cycle Engineering is presenting web-based seminars on issues related to reliability of electronic products and systems.Upcoming Seminars: See CALCE EVENTS
On September 15, 2020, Michael Osterman presented Solder Interconnect Fatigue Life Modeling and High Performance Pb-Free Solders
On August 11, 2020, Aris Christou presented Are Fatigue-Free Flexible Displays Possible?
On June 30, 2020, Dr. Diganta Das presented Long-Term Storage of Electronic Components: What Do You Need to Consider
On June 23, 2020, Jack Wang presented Hybrid Prognostics for Automotive Electronic Control Unit Using Stress Sensors
On June 16, 2020, Michael Osterman presented Will Your Product Meet Its Life Requirement? There is help.
On June 9, 2020, David Leslie presented Vibration Interconnect Fatigue: Have You Considered Temperature?
On June 2, 2020, Michael Azarian presented Reliability of Multilayer Polymer Aluminum Electrolytic Capacitors
On May 26, 2020, Patrick McCluskey presented Cooling of Integrated Electric Motors
On May 19, 2020, Weiping Diao presented Knee Point Prediction and Anomaly Detection in the Capacity Fade of Li-ion Batteries
On May 12, 2020, Aris Christou presented Reliability and Defects Which Impact Wide Bandgap Power Electronics
On May 5, 2020, Prabhat Janamanchi presented Behavior of Heat Activated Films
On April 28, 2020, Patrick McCluskey presented Determining Thermomechanical Reliability of Flip Chipped SiC Power Device Assemblies
On April 21, 2020, Michael Azarian presented How to Evaluate and Select Lubricants for Electrical Contacts
On April 14, 2020, Diganta Das presented Is Your Reliability Prediction Reliable?
On April 7, 2020, Deng Chen presented Are You Considering Irregular Loading Cycles in Solder Interconnect Life Estimations?
On February 18, 2020, Michael Osterman presented Corrosion Testing of Electronic Equipment
On January 28, 2020, Saurabh Saxena presented Effects of Rest Time and Temperature on Li-ion Battery Degradation
On December 10, 2019, Qian Jiang presented Investigation of Copper RDL Early Fatigue Failure in WLCSP Under Board Level Thermal Cycling (BLTC)
On November 26, 2019, Jonathan Kordell presented Fiber Optic Conjugate Stress Sensor for Prognostic Health Monitoring (PHM)
On September 17, 2019, Bongtae Han presented What should be used to predict residual stresses or warpage after molding processes: Mold shrinkage, Chemical shrinkage or Both?
On August 20, 2019, Subramani Manoharan presented Concerns with Copper Wire Bonds under Thermal Aging and Cycling Condition
On June 7, 2019, Jennifa Li presented Effect of Ferroelectric Properties on Mechanical Behavior of Class II Multilayer Ceramic Capacitors
On May 14, 2019, Prof. A. Dasgupta and Prof. S. Das presented Printed Electronic Systems: Manufacturing for Reliability (MfR)
On April 9, 2019, Michael Osterman presented Modeling Thermal Fatigue Life of Solder Interconnects with Varying Silver Content
On January 15, 2019, Michael Osterman presented Does Aging Degrade the Reliability of Pb-free Solder Interconnects?
On December 4, 2018, Michael Azarian presented Qualification and Reliability of Microvias
On November 13, 2018, Diganta Das presented Data and Models for Electronic Component Reliability Assessment
On September 18, 2018, Bongtae Han presented Warpage --- Why still difficult to predict and/or measure?
On July 10, 2018, Yizhou Lu presented Application of Unsupervised Machine Learning Techniques in Prognostics of Power Electronics
On June 19, 2018, Jing Tian presented Machinery Anomaly Detection Under Indeterminate Operating Conditions
On June 5, 2018, Prof. Abhijit Dasgupta and Prof. Siddhartha Das presented 3D Printed Electronics: How Innovative Are They? How Reliable Are They Likely to Be?
On May 15, 2018, Dr. Diganta Das presented Parts and Assembly Storage Life: How to Determine and Manage
February 28, 2017, Prof. Patrick McCluskey presented Reliability of 3D Integrated Embedded Cooling Structures
On January 17, 2017, Dr. Diganta Das presented Electronic Component Information for Part Selection and Management
On July 12, 2016, Dr. Michael Osterman presented Tin Pest Resistance of Lead-Free Solders in Low-Temperature Applications .
On June 28, 2016,
On May 10, 2016, Hao Huang presented Behavior of Joints Bonded with Pressure-Sensitive Adhesives (PSAs)