CALCE Web Seminars

 

Purpose

Rapid advances in electronic products and systems require special efforts to educate the technical workforce. These special efforts include the use of systematic just-in-time transfer of state-of-the-art knowledge derived from the latest research results.

To meet these challenges, the Center for Advanced Life Cycle Engineering is presenting web-based seminars on issues related to reliability of electronic products and systems.

Upcoming Seminars:

On September 17, 2019, Bongtae Han will present What should be used to predict residual stresses or warpage after molding processes: Mold shrinkage, Chemical shrinkage or Both?

Past Seminars:

On August 20, 2019, Subramani Manoharan presented Concerns with Copper Wire Bonds under Thermal Aging and Cycling Condition

On June 7, 2019, Jennifa Li presented Effect of Ferroelectric Properties on Mechanical Behavior of Class II Multilayer Ceramic Capacitors

On May 14, 2019, Prof. A. Dasgupta and Prof. S. Das presented Printed Electronic Systems: Manufacturing for Reliability (MfR)

On April 9, 2019, Michael Osterman presented Modeling Thermal Fatigue Life of Solder Interconnects with Varying Silver Content

On January 15, 2019, Michael Osterman presented Does Aging Degrade the Reliability of Pb-free Solder Interconnects?

On December 4, 2018, Michael Azarian presented Qualification and Reliability of Microvias

On November 13, 2018, Diganta Das presented Data and Models for Electronic Component Reliability Assessment

On September 18, 2018, Bongtae Han presented Warpage --- Why still difficult to predict and/or measure?

On August 28, 2018, Michael Osterman presented CALCE Simulation Assisted Reliability Assessment Software - Release 8.3.0

On July 10, 2018, Yizhou Lu presented Application of Unsupervised Machine Learning Techniques in Prognostics of Power Electronics

On June 19, 2018, Jing Tian presented Machinery Anomaly Detection Under Indeterminate Operating Conditions

On June 5, 2018, Prof. Abhijit Dasgupta and Prof. Siddhartha Das presented 3D Printed Electronics: How Innovative Are They? How Reliable Are They Likely to Be?

On May 15, 2018, Dr. Diganta Das presented Parts and Assembly Storage Life: How to Determine and Manage

February 28, 2017, Prof. Patrick McCluskey presented Reliability of 3D Integrated Embedded Cooling Structures

On January 17, 2017, Dr. Diganta Das presented Electronic Component Information for Part Selection and Management

On July 12, 2016, Dr. Michael Osterman presented Tin Pest Resistance of Lead-Free Solders in Low-Temperature Applications .

On June 28, 2016, James Twomey presented Offline Cycle Extraction from Complex Load Histories using Multi-Parameter Rainflow Counting.

On June 7, 2016, Prof. Pat McCluskey presented State of Lead Free Die Attach Materials.

On May 10, 2016, Hao Huang presented Behavior of Joints Bonded with Pressure-Sensitive Adhesives (PSAs)

 

 

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