CALCE Web Seminars



Rapid advances in electronic products and systems require special efforts to educate the technical workforce. These special efforts include the use of systematic just-in-time transfer of state-of-the-art knowledge derived from the latest research results.

To meet these challenges, the Center for Advanced Life Cycle Engineering is presenting web-based seminars on issues related to reliability of electronic products and systems.

Upcoming Seminars: See CALCE EVENTS

Past Seminars:

On September 23, 2021, Chris Risso presented Can 3D Printing be a Viable Method for Repairing Electronic Components?

On September 9, 2021, Patrick McCluskey presented Additive Manufacturing for Planar Magnetics

On August 19, 2021, David Leslie presented Pitfalls of Creep Indentation Testing of Sintered Silver Interconnects

On August 5,2021, Abhishek Deshpande presented Why Current Approaches for Solder Joint Modeling are Inadequate - and What to Do About It

On February 16, 2021, Diganta Das presented Are You Getting the Right Information for Your Electronic Parts?

On January 12, 2021, Michael Azarian presented Are You Getting The Most Out Of Your System? - Prognostics and Health Management

On December 8, 2020, Qian Jiang presented Are We Modeling Solder Joints Correctly? A Grain-Scale Modeling Approach

On November 17, 2020, Abhijit Dasgupta presented Printed Hybrid Electronics (PHEs): Are They Really Ready for Deployment?

On September 15, 2020, Michael Osterman presented Solder Interconnect Fatigue Life Modeling and High Performance Pb-Free Solders

On August 11, 2020, Aris Christou presented Are Fatigue-Free Flexible Displays Possible?

On June 30, 2020, Dr. Diganta Das presented Long-Term Storage of Electronic Components: What Do You Need to Consider

On June 23, 2020, Jack Wang presented Hybrid Prognostics for Automotive Electronic Control Unit Using Stress Sensors

On June 16, 2020, Michael Osterman presented Will Your Product Meet Its Life Requirement? There is help.

On June 9, 2020, David Leslie presented Vibration Interconnect Fatigue: Have You Considered Temperature?

On June 2, 2020, Michael Azarian presented Reliability of Multilayer Polymer Aluminum Electrolytic Capacitors

On May 26, 2020, Patrick McCluskey presented Cooling of Integrated Electric Motors

On May 19, 2020, Weiping Diao presented Knee Point Prediction and Anomaly Detection in the Capacity Fade of Li-ion Batteries

On May 12, 2020, Aris Christou presented Reliability and Defects Which Impact Wide Bandgap Power Electronics

On May 5, 2020, Prabhat Janamanchi presented Behavior of Heat Activated Films

On April 28, 2020, Patrick McCluskey presented Determining Thermomechanical Reliability of Flip Chipped SiC Power Device Assemblies

On April 21, 2020, Michael Azarian presented How to Evaluate and Select Lubricants for Electrical Contacts

On April 14, 2020, Diganta Das presented Is Your Reliability Prediction Reliable?

On April 7, 2020, Deng Chen presented Are You Considering Irregular Loading Cycles in Solder Interconnect Life Estimations?

On February 18, 2020, Michael Osterman presented Corrosion Testing of Electronic Equipment

On January 28, 2020, Saurabh Saxena presented Effects of Rest Time and Temperature on Li-ion Battery Degradation

On December 10, 2019, Qian Jiang presented Investigation of Copper RDL Early Fatigue Failure in WLCSP Under Board Level Thermal Cycling (BLTC)

On November 26, 2019, Jonathan Kordell presented Fiber Optic Conjugate Stress Sensor for Prognostic Health Monitoring (PHM)

On September 17, 2019, Bongtae Han presented What should be used to predict residual stresses or warpage after molding processes: Mold shrinkage, Chemical shrinkage or Both?

On August 20, 2019, Subramani Manoharan presented Concerns with Copper Wire Bonds under Thermal Aging and Cycling Condition

On June 7, 2019, Jennifa Li presented Effect of Ferroelectric Properties on Mechanical Behavior of Class II Multilayer Ceramic Capacitors

On May 14, 2019, Prof. A. Dasgupta and Prof. S. Das presented Printed Electronic Systems: Manufacturing for Reliability (MfR)

On April 9, 2019, Michael Osterman presented Modeling Thermal Fatigue Life of Solder Interconnects with Varying Silver Content

On January 15, 2019, Michael Osterman presented Does Aging Degrade the Reliability of Pb-free Solder Interconnects?

On December 4, 2018, Michael Azarian presented Qualification and Reliability of Microvias

On November 13, 2018, Diganta Das presented Data and Models for Electronic Component Reliability Assessment

On September 18, 2018, Bongtae Han presented Warpage --- Why still difficult to predict and/or measure?

On July 10, 2018, Yizhou Lu presented Application of Unsupervised Machine Learning Techniques in Prognostics of Power Electronics

On June 19, 2018, Jing Tian presented Machinery Anomaly Detection Under Indeterminate Operating Conditions

On June 5, 2018, Prof. Abhijit Dasgupta and Prof. Siddhartha Das presented 3D Printed Electronics: How Innovative Are They? How Reliable Are They Likely to Be?

On May 15, 2018, Dr. Diganta Das presented Parts and Assembly Storage Life: How to Determine and Manage

February 28, 2017, Prof. Patrick McCluskey presented Reliability of 3D Integrated Embedded Cooling Structures


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