Open Forum
Welcome to the Open Forum on electronic products and systems development and applications. I consider the issues discussed here to be important to the electronics industry. If you have any comments on any of the topics discussed or would like to suggest topics for future discussion, please contact me. We thank IEEE Transactions on Components, Packaging, and Manufacturing Technology for their support and promotion of ideas and technology (eps.ieee.org).
Dr. Michael Pecht, Professor and DirectorThe Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland
College Park, MD 20742
pecht@umd.edu
Topics Covered:
- Software Obsolescence - Complicating the Part and Technology Obsolescence Management Problem
- Semiconductor Manufacturers' Efforts to Improve Trust in the Electronic Part Supply Chain
- Assessment of Organizational Reliability Capability
- Prognostics and Health Management of Electronics
- Are You Ready for Lead-Free Electronics?
- The Role of the U.S National Highway Traffic Safety Administration in Automotive Electronics Reliability and Safety Assessment
- Sensor Technology Roadmapping Efforts at iNEMI
- Using Cut-Out Features for Efficient Printed Circuit Board Testing and Failure Analysis
- How China Is Closing the Semiconductor Technology Gap
- Tin Whiskering Risk Factors
- Optimum Technology Insertion Into Systems Based on the Assessment of Viability
- Are U.S. Jobs Moving to China?
- Why Electronics in China - A Business Perspective
- Critique of EIA SSB-1: Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and Other Rugged Applications
- Aging Avionics-What Causes It and How to Respond
- Handling the Migration to Lead Free
- Prognostic Methodology for Deep Submicron Semiconductor Failure Modes
- An Avionics Guide to Uprating of Electronic Parts
- A Perspective on North American PWB Technology Hurdles and Barriers and a Strategy to Overcome Obstacles
- The Electronic Part Life Cycle
- Nano-to-Millimeter Scale Integrated Systems
- Reliability Prediction and Assessment of Electronic Systems and Equipment
- The Role of Physical Implementation in Virtual Prototyping of Electronic Systems
- Getting the Quality and Reliability Terminology Straight
- Review of STACK Documents
- What Drives Research
- The Realism of FAA Reliability-Safety Requirements and Alternatives
- Research Directions in Electronic Packaging
- QML Assessment
- Understanding and Solving the Real Reliability Assurance Problems
- Uprating
- Thermal Derating
- Burn In
- Electronic Components Obsolescence
- Issues Affecting Early Affordable Access to Leading Electronics Technologies by the U.S. Militay and Government