ITherm 2000 Proceedings, Vol. 2. pp. 385-390, May 2000.

Numerical and Experimental Thermal Characterization of a Liquid Cooled AlSiC Power Electronics Base Plate with Integral Pin Fins

Kevin A. Moores and Yogendra K. Joshi
CALCE - Electronic Packaging Consortium, Mechanical Engineering Department
University of Maryland, College Park , MD, USA 20742
kamoores@calce.umd.edu, Yogi@eng.umd.edu

Gerhard Schiroky
Lanxide Electronic Components Inc.
P.O. Box 9409, 1300 Marrows Rd.
Newark, DE, USA 19714-9409
schiroky@lec-inc.com

Abstract:

In this study, we present the thermal analysis and experimental performance assessment of an aluminum silicon carbide (AlSiC) metal matrix composite (MMC) base plate with integral cooling fins. By attaching a pin-finned base plate to an open-chambered flow-through heat sink, the mechanical interface between the base plate and cooling medium is eliminated. This reduces the overall thermal resistance and improves module reliability as compared with traditional base plate cooling schemes. Computational fluid dynamics and heat transfer techniques were employed to model the thermal and hydrodynamic resistance characteristics through the pin fin structure of a prototype base plate design. A "unit-cell" approach was employed to avoid the computational expense of modeling the entire pin array. Performance was verified experimentally in a closed loop test facility using water as the cooling fluid. It was found that the unit-cell approach produced excellent agreement with experimental pressure drop data for the full array, while heat transfer predictions were adequate.

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