Advanced Packaging, pp. 39-42, February 2001

Palladium-plated Packages Creep Corrosion and Its Impact on Reliability

Dr. Jingsong Xie
Redmond, WA

Dr. Michael Pecht
CALCE Electronic Products and Systems Center
University of Maryland
College Park, MD 20742


As a lead frame finish material, palladium has many advantages over tin-lead (SnPb) solder; it is more environmentally friendly and the package assembly process with palladium-plated lead frames is more efficient. However, palladium also provides a surface over which corrosion products can migrate and cause leakage current failure modes, especially in fine-pitch devices. The time dependent migration of corrosion products is known as creep corrosion. Creep corrosion behavior is dependent upon the corrosion product, the surface material, and the environmental and operating conditions.

Complete article is available to CALCE Consortium Members.

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