Professional Development Courses For Industry
“Wow! Outstanding overview.” – Joshua Sisson, Bose Corporation
“Very educational and interesting course. Hands-on demos were excellent. Highly recommended.”
– Michael Cascio, Northrop Grumman Corporation
“CALCE did a great job of identifying the cause of failure and corrective actions with my parking meter products.”
– Glenn Hellman, Driven Forward LLC
About Our Courses
Planning a Course
About Our Courses
with you to "tune" courses to your needs.
- Course Length: Most courses are one day classes with 6.5 hours contact time.
- Prerequisites: Courses are open to all practicing professionals. (Participants must have appropriate college degrees to earn continuing education credit (CEC) for courses.)
- Facility: Client is responsible for providing room suitable for expected number of participants with presentation screen and computer projection equipment.
- Materials: A single set of handouts will be shipped to a designated location. Client is responsible for making additional copies available to course participants. Please allow one week for shipment of handouts.
At an additional cost, handouts for a specified number of course participants can be provided.
- Cost: Cost for each one day class is between $4500-6000 USD, depending on the level of customization. Continuing education credits can be provided at an additional cost per participant.
- Scheduling: Scheduling courses is subject to availability of instructors. Contact email@example.com
Available On-site and at CALCE Headquarters
Participants will learn how to make accelerated stress testing a value-added activity and use accelerated test results to take pro-active corrective measures early in the design and production phases,
thus ensuring consistently high reliability and quality of design and processes. Learn more
|Component Authentication and Screening
Attendees will learn
about the status of the electronic part distribution market and how it has changed over the past decade. The movement
of the manufacturing and technology know-how across the globe will be covered to understand
the international aspect of the counterfeit electronics supply chain. Learn more
| Counterfeit Electronics
The course will cover various
authentication techniques that are being used and developed to make counterfeiting of electronics more difficult.
It will include overt and covert methods of authentications. The course will close with specific suggestions and
recommendations how you can protect your supply chain including how to select distributors and monitor your suppliers.
It will also have recommendations to the electronic part manufacturers, regulators, government enforcement
and procurement agencies on how to reduce the risks from counterfeit electronic parts. Learn more
Part Obsolescence Forecasting, Mitigation and Management
This course reviews DMSMS management best
practices, the various mitigation approaches, and available methods of forecasting the obsolescence of parts.
In addition, pro-active methods for managing obsolescence are discussed,
including design refresh planning and the use of ASICs. Learn more
Product and System Cost Analysis
This course provides an in-depth understanding of the process of
predicting the cost of systems. Elements of traditional engineering economics are melded with manufacturing
process modeling, life cycle cost management concepts, and selected concepts from environmental life cycle
cost assessment to form a
practical foundation for predicting the real cost of electronic products. Learn more
| Failure Analysis of Electronics Short Course
An intensive 4-day
course on Failure Analysis of Electronics is being offered jointly by CALCE and Buehler. The four day course will cover specimen preparation
and materials analysis techniques applicable to electronic assemblies, components, and devices. The course consists of a combination of
classroom instruction, demonstrations, and hands-on laboratory training. Lecture topics includes physics-of-failure root cause analysis,
guidelines for selection of analytical tools and, practical instruction on laboratory techniques. The laboratory portion of the course
includes demonstrations and step-by-step hands-on sample preparation using metallographic techniques on the latest failure analysis equipment
In addition, a number of important non-destructive and destructive analysis techniques will be demonstrated. Learn more
This course details the performance and reliability issues involved in designing
electronic systems for use at temperatures above 125°C. It will provide the attendee with the tools and information
needed to design electronic systems that will perform reliably in extreme temperature environments, such as are
found in defense,
avionic and automobiles applications. Learn more
This course is intended to
provide the audience with the current status of lead-free reliability and consideration of issues arising from the
transition to lead-free assembled electronic hardware. The course provides up to date information on what companies
should understand about lead-free materials, the reliability of lead-free assemblies, the risk posed by tin whiskers,
as well as mixed solder reliability and rework and
repair lead-based and lead-free assemblies. Learn more
Light Emitting Diode (LED) Reliability
This course will cover the latest progress in understanding of failure mechanisms of LEDs that occur at the die, interconnects, and within the package including electrostatic discharge, delamination, and phosphor thermal quenching. The driving factors for precipitating these mechanisms will be discussed to help the developers and users of LEDs control the mechanisms and assess reliability. The course will also inform on the relevant standards for LED testing and reliability assessment, the qualification methods currently in use by major LED manufacturers, and the qualification philosophies that will be most suitable to meet future needs for LED lighting applications.
Methods as a Tool for Microelectronics Product Development
This course teaches the basic concepts of optical
methods as applied to microelectronics product development. It reviews numerous applications, which treat a great
diversity of mechanics and materials studies in electronic packaging. Practical aspects of the
technology are discussed in the final section. Learn more
of Failure and Reliability
This course introduces the classical reliability concepts and
relates the concepts to the physics of failure approach. The information provided in this course will be
useful for implementing a physics-of-failure methodology for the life cycle of a product. The participants
will learn how to develop and migrate to physics-of-failure based reliability assessment programs. The course
teach how to facilitate the introduction of the physics-of-failure methodology among the complete supply
chain of the product. Learn more
Materials for Microelectronics
A plastic-encapsulated microelectronics (PEM) component, often called
a plastic package, consists of an integrated circuit chip physically attached to a leadframe, electrically interconnected
to input-output leads, and molded in a plastic that is in direct contact with the chip, leadframe, and interconnects.
In comparison, a hermetically sealed microcircuit (generally called a hermetic package) consists of an integrated
circuit chip mounted in a metal or ceramic cavity, interconnected to the leads,
and hermetically sealed to maintain a contact environment within the package. Learn more
and Health Management
The course presents the tools and techniques for development and implementation of
prognostics and health monitoring in terms of novel methods for in-situ monitoring, approaches for resource efficient
data collection, algorithms for data reduction and parameter extraction, methods for identifying and analyzing
precursors based on failure mechanisms, and techniques for predictions that can be used for assisting maintenance
and logistics decisions. Different approaches for prognostics are presented along with implementation case-studies. Learn more
Root-Cause Failure Analysis
This course will present a
methodology for identifying potential failure mechanisms based on the failure history. Appropriate failure
analysis techniques for various failure mechanisms will be discussed, with step-by-step details provided.
Example pictures and case studies will be presented.
The course will conclude with corrective and preventative actions, the most crucial part of a failure analysis report. Learn more
- Electronic Parts Use Outside of Temperature Range
The ratings on electronic parts and selection of their
use for an application environment are a matter of concern for engineers in all industries. There are standards available for derating of parts that are not application specific and often outdated. This course will discuss the part ratings, how ratings are developed, and what their implications are in selecting the use
environment for parts to meet the reliability and performance requirements of the system.
Qualification and Reliability Assessment
This course (Component level and PCB level) will provide the attendees
with the knowledge necessary to apply such a methodology to the qualification of components and the reliability
assessment of electronic systems. Each section provides introduction to physics-of-failure based virtual qualification
and application specific reliability assessment. The course will demonstrate how to use manufacturer's test data together
with failure modeling to qualify a component for use in a particular application. The course will also demonstrate the
application of this virtual qualification technique to the insertion of commercial components into high-temperature,
high-power, automotive, and avionic applications. The use of virtual qualification for building reliability into power
modules will also be discussed. The course will conclude with a discussion of the probabilistic nature of reliability
assessment and with a demonstration of
computer-aided tools for virtual qualification and application-specific reliability assessment. Learn more
Planning Your Course
the general course outlines and background information from the list on the right
then select the
course or courses that you would like to be offered at your company
using this link. Tell us the
date(s), locations and any additional information about your
We prefer a lead time of at least three weeks for planning.
Bldg. 89, Room 1103
University of Maryland
College Park, MD 20742
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