ABSTRACT:

The thermal environment is an important consideration in design of electronics. Temperatures that arise during the use of electronics can influence performance, and affect the overall product reliability, and present safety concerns. Unfortunately, reliability standards and existing rules of thumb portray thermal environment in the one dimensional form of maximum steady state temperature and the effect of the steady state temperature is then treated using the Arrhenius type equation to model electronic part reliability. This simple treatment of a complex interaction between material systems, chemical process, and device physics when used in the design process can result in unreliable and costly products.

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