Failure Analysis

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- Destructive Evaluation -
- Decapsulation -

As a member of the CALCE Consortium, Nisene has consistently provided CALCE with state-of-the-art decapsulation equipment. The Model 250, the latest in a line of high technology decapsulators, is an automated system that uses fuming nitric or sulfuric acid to expose the silicon die. The precise nature of decapsulation allows for measurement of wirebond strengths and an optical view of operating integrated circuits (ICs).


Image of a decapped plastic quad-flat pack (PQFP)


Electrical Testing

Non-Destructive Evaluation

Destructive Evaluation




*Optical Microscopy

*Scanning Electron Microscopy (SEM)

*Energy Dispersive Microscopy (EDS)

Focused Ion Beam (FIB) Imaging

*Scanning Magnetic Microscopy (SMM)

Transmission Electron Microscopy (TEM)

*Fourier Transform Infrared Spectroscopy (FTIR)

*Contact Resistance Measurements

Assessment of Popcorning in PEMs

*These techniques are also performed during