Failure Analysis


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- Destructive Evaluation -

- Focused Ion Beam Imaging -

Using a finely focused ion beam, FIB technology can perform product failure analysis at a detail much finer than previously possible. The operator is able to quickly and selectively remove dielectric or metal layers for probing and material analysis of underlying surfaces. Rapid cross-sections of buried circuitry can also be performed with sub-micron accuracy.

Introduction

Electrical Testing

Non-Destructive Evaluation

Destructive Evaluation

Microsectioning

Decapsulation/Delidding

*Optical Microscopy

*Scanning Electron Microscopy (SEM)

*Energy Dispersive Microscopy (EDS)

Focused Ion Beam (FIB) Imaging

*Scanning Magnetic Microscopy (SMM)

Transmission Electron Microscopy (TEM)

*Fourier Transform Infrared Spectroscopy (FTIR)

*Contact Resistance Measurements

Assessment of Popcorning in PEMs

*These techniques are also performed during