Failure Analysis


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- Destructive Evaluation -

- Microtesting -

Interconnects are critical to the proper functioning of electronic components and are a common failure site due to requirements for small size, power and signal conduction, thermal diffusivity, and mechanical support. Microtesting plays an important role in providing information on the quality and integrity of these component interconnects after production, storage, and use. Microtesting includes the measurement of the strength of die adhesives, wires, tabs, ball bonds, wedge bonds, soldered surface mount leads, solder ball/bond pad interfaces, and solder bump/under bump metallurgy (UBM) interfaces (the later two tests are performed on ball grid arrays (BGAs)).

To perform microtesting, CALCE uses the DAGE 2400. The 2400 is a precision universal strength testing system for evaluating micro-electronic structures. Information from tests performed on the 2400 can help ensure manufacturers of high-reliability electronic components of high strength wire bonds and die adhesion in virgin parts and those components which have undergone accelerated testing. The DAGE 2400 performs:

1. Wire bond pull tests up to 1 kg;

2. Ball bond shear and aluminum wedge shear tests;

3. Die shear tests up to 20 kg;

4. Solder ball and solder bump pull and shear tests

Introduction

Electrical Testing

Non-Destructive Evaluation

Destructive Evaluation

Microsectioning

Decapsulation/Delidding

Microtesting

*Optical Microscopy

*Scanning Electron Microscopy (SEM)

*Energy Dispersive Microscopy (EDS)

Focused Ion Beam (FIB) Imaging

*Scanning Magnetic Microscopy (SMM)

Transmission Electron Microscopy (TEM)

*Fourier Transform Infrared Spectroscopy (FTIR)

*Contact Resistance Measurements

Assessment of Popcorning in PEMs

*These techniques are also performed during