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Non-Destructive Evaluation (NDE) is designed to provide as much information on the failure site, failure mechanism, and root cause of failure without causing any damage to the product or obscuring or removing valuable information. The latter part of this sentence can be very important when the electronic part is still functioning.
A significant amount of failure information is available through visual inspection and the more traditional NDE methods, such as:
However, breakthroughs in failure analysis technology over the last few years have opened up the number of avenues available in non-destructive evaluation. These avenues include state-of-the-art methods, such as Scanning Magnetic Microscopy (SMM) and Infrared Imaging Systems with the latest filtering algorithims, as well as non-traditional techniques, such as Fourier Transform Infrared Spectroscopy (FTIR), Contact Resistance Measurements, and Atomic Force Microscopy (AFM).
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