X-ray microscopy permits nondestructive assessment of internal damage, defects, and degradation in microelectronic devices. Illuminating a sample with X-ray energy provides images based on material density that allow characterization of solder voiding, wirebond sweep, and wirebond breakage in components. In addition, X-ray microscopy can reveal anomalies such as die attach voiding, solder pooling, or die shifting. Used in conjunction with scanning acoustic microscopy (SAM), X-ray micrography is a powerful non-destructive tool for pinpointing failure sites in electronic components.

X-ray image of a Field Effect Transistor (FET) showing voids in the solder attachment and inclusions bridging across Gate and Source terminals.

Introduction

Electrical Testing

Destructive Evaluation