CALCE faculty and research staff are dedicated to the development and expansion of a knowledge resource on the reliability of cost-effective and sustainable electronic project and systems. To access a comprehensive list of CALCE publications, click here. The sublist of these publications that is of particular importance and interest to the MEMS  is presented below.

Articles

Embedded 3D BioMEMS for multiplexed label-free detection S. Arvind, R. Doraiswami and M. Pecht, Proceedings of the 61st Electronic Components and Technology Conference, June 1- 3, 2011, Orlando, FL.

Forward-stepwise Regression Analysis for Fine Leak Batch Testing of Multiple MEMS Package, C. Jang, B. Youn, P. F. Wang. B. Han and S.-J. Ham, Microelectronics Reliability, Vol. 18, No. 3, pp. 577-587 (2010).

Biocompatible Polymer Composite Material for Highly Sensitive Point-of-care BioMEMS Microcantilever Sensors, S. Arvind, R. Doraiswami and M. Pecht, Proceedings of the 2010 SMTA International Conference and Exhibition, October 24-28, 2010, Orlando, FL.

Quantitative Characterization of True Leak Rate of Micro to Nanoliter Packages Using a Helium Mass Spectrometer, A. Goswami, B. Han, S.-J. Ham and B.-G. Jeong, IEEE Transactions on Advanced Packaging, Vol. 32, No. 2, pp. 440-447 (2009).

Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis, C. Jang, A. Goswami and B. Han, IEEE/ASME Journal of Microelectromechanical Systems, Vol. 18, No. 3, pp. 577-587 (2009).

In-situ Measurement of Gas Diffusion Properties of Polymeric Seals Used in MEMS Packages by Optical Gas Leak Test, C. Jang, A. Goswami, B. Han and S. Ham, Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 8, No. 4, 043025 (2009).

On Applicability of MIL-Spec-Based Helium Fine Leak Test to Packages with Sub-micro liter Cavity Volumes, A. Goswami and B. Han, Microelectronics Reliability, Vol. 48, pp. 1815–1821 (2008).

On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages, A. Goswami and B. Han, IEEE Transactions on Advanced Packaging, Vol. 31, No. 1, pp. 14-21, 2008.

Reliability Assessment of Delamination in Chip-to-Chip Bonded MEMS Packaging, R. Swaminathan, H. Bhaskaran, P. Sandborn, G. Subramanian, M. Deeds, and K. Cochran, IEEE Transactions on Advanced Packaging, Vol. 26, No. 2, pp. 141-151, May 2003.

Carrier-Level Packaging and Reliability of a MEMS-Based Safety and Arming Device, M. Deeds, K. Cochran, R. Swaminathan, and P. Sandborn, Proceedings MRS Spring Meeting, April 2001.

Packaging of a MEMS Based Safety and Arming Device, M. Deeds, K. Cochran, P. Sandborn and R. Swaminathan, ITHERM 2000 Proceedings, Vol. 1, pp. 107-112, May 2000.

Test and Evaluation of Chip-to-Chip Attachment of MEMS Devices, P. Sandborn, R. Swaminathan, G. Subramanian, M. Deeds, and K. Cochran, ITHERM 2000 Proceedings, Vol. 1, pp. 133-140, May 2000.

Delamination Study of Chip-to-Chip Bonding for a LIGA Based Safety and Arming System, G. Subramanian, M. Deeds, K. Cochran, R. Raghavan, P. Sandborn, Proc. SPIE Symposium on Micromachining and Microfabrication, pp. 112-119, Sept. 1999.