Proc. MRS Spring Meeting, April 2001
Indian Head Naval Surface Warfare Center
University of Maryland
College Park, MD 20742
Packaging of MEMS devices introduces new challenges to the package architecture. MEMS systems include interfaces, processes, and materials foreign to the IC packaging industry. To build reliable MEMS systems, failure modes must be identified and understood. In addition, measurement techniques must be developed to interrogate critical aspects of the package.
The carrier-level packaging for a MEMS-based Safety and Arming (S&A) system has been considered. The package houses the S&A chip, initiator chip, and a deflection delimiter. The carrier-level package provides electrical, fiber optic, pressure, and explosive interconnects. The S&A chip contains a moving slider that either exposes a hole through the chip or blocks the hole, as well as various environmental sensors and actuators that lock the slider into a safe position. The initiator chip converts electrical energy to mechanical energy upon demand to initiate the explosive train. The delimiter is placed between the S&A chip and the initiator chip to restrict out-of-plane movement of the MEMS structures. Various carrier approaches have been assessed. The carrier designs include hermetic, non-hermetic, and ventilated packages. The impact of moisture ingress and egress from the carrier packaging have been studied as a function of the performance of MEMS parts.
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