IEEE Transactions on Advanced Packaging, Vol. 31, No. 1, pp. 14-21, 2008

On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages



Arindam Goswami
and
Bongtae Han
Abstract:

Theoretical and practical ranges of leak rates measurable by the helium mass spectrometer are characterized. The effect of noise due to: 1) background helium present in the spectrometer and 2) desorption of helium that attaches itself to the specimen surface during bombing is quantified experimentally. The results guide a framework to extract the true leak rate from the measured leak rate profile. An optical interferometry based hermeticity measurement technique for ultra-fine leaks is proposed. The setup to implement the technique is described and a preliminary experimental result is reported.

Index Terms: Helium fine leak test, hermeticity, optical interferometry, theoretical and practical limits, true leak rate.

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