Indian Head Naval Surface Warfare Center
Peter Sandborn and Rajesh Swaminathan
CALCE Electronic Products and Systems Center
University of Maryland
College Park, MD 20742
Packaging of MEMS devices introduces new challenges to the package architecture. MEMS systems introduce new interfaces, processes, and materials foreign to the IC packaging industry. To build reliable MEMS systems, failure modes must be activated and understood. In addition, the metrology techniques must be developed to interrogate critical aspects of the package. The system presented in this paper is a MEMS based safety and arming device (S&A) for underwater weapons. Critical components, packaged in various hermetic and non-hermetic configurations, are cycled through a series of metrologies and environmental conditioning.
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