Abstract:

Packaging of MEMS devices introduces new challenges to the package architecture. MEMS systems introduce new interfaces, processes, and materials foreign to the IC packaging industry. To build reliable MEMS systems, failure modes must be activated and understood. In addition, the metrology techniques must be developed to interrogate critical aspects of the package. The system presented in this paper is a MEMS based safety and arming device (S&A) for underwater weapons. Critical components, packaged in various hermetic and non-hermetic configurations, are cycled through a series of metrologies and environmental conditioning.

Complete article is available to CALCE Consortium Members.