Microelectronics Reliability 50 (2010) 507–513

Forward-stepwise Regression Analysis for Fine Leak Batch Testing of Wafer-level Hermetic MEMS Packages

Changsoo Jang a, Byeng Dong Youn a, Ping F. Wanga, Bongtae Han a,*, Suk-Jin Hamb
a University of Maryland, College Park, MD 20742, USA
b Samsung Electro-Mechanics, Central R&D Institute, Suwon, Gyeonggi-do 443-743, Korea


An advanced regression scheme is proposed to analyze fine leak batch testing data of multiple MEMS packages. The scheme employs the forward-stepwise regression method to infer the information of leaky packages from a batch test data. The analysis predicts the number of leaky packages and the true leak rate of each leaky package in a progressive manner. The scheme is implemented successfully using an actual batch test data obtained from wafer-level hermetic MEMS packages. An error analysis is followed to define the applicable domain of the scheme. Advanced formulations are also suggested to extend the applicable domain.

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