MEMS Delamination

Proc. SPIE Symposium on Micromachining and Microfabrication, pp. 112-119, Sept. 1999.

Delamination Study of Chip-to-Chip Bonding for a LIGA Based Safety and Arming System

G. Subramanian^a, M. Deeds^b, K. Cochran^b, R. Raghavan^a, P. Sandborn^a

^aCALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742

^bNaval Surface Warfare Center (NSWC), Indian Head, MD 20640

ABSTRACT:

The development of a miniature underwater weapon Safety and Arming (S&A) system requires reliable chip-to-chip bonding of die that contain microelectromechanical actuators and sensors fabricated using a LIGA MEMS fabrication process. Chip-to-chip bonding is assessed for several different bond materials (Indium solder, thermoplastic paste, thermoplastic film and epoxy film), and bonding configurations (with an Alloy 42 spacer, silicon to ceramic, and silicon to silicon). Metrology using Acoustic Micro Imaging (AMI) has been developed to determine the fraction of delamination of samples.

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