CALCE Webinar for September 2011 - Assessment of Electrical Failure Risk due to Tin Whiskers

September 20, 2011
11:00am US EDT

CALCE Webinar Event

Dr. Michael Osterman (

View Presentation (PDF)

View Recorded Presentation (MP4)

Whisker Buckling

MVA Movie 50V 760torr

MVA Movie 50V 70torr

Tin and metal whisker present a failure risk to electronic equipment. Tin whiskers have been attributed to costly failures in satellites, power plants, and medical equipment. CALCE has been conducting research related to voltage requirement to initiate an electrical circuit as well as circuit and pressure requirements to initiate a metal vapor arc. This web seminar will provide a review of this research.

About the Presenter:

Dr. Michael Osterman (Ph.D. Mechanical Engineering, University of Maryland, College Park) is a Senior Research Scientist and the director of the CALCE Electronic Products and System Consortium at the University of Maryland. He heads the development of simulation assisted reliability assessment software for CALCE and simulation approaches for estimating time to failure of electronic hardware under test and field conditions. Dr. Osterman is one of the principle researchers in the CALCE effort to develop simulation models for failure of Pb-free solders. In addition, he has lead CALCE in the study of tin whiskers since 2002 and has authored several articles related to the tin whisker phenomenon. Further, he has written various book chapters and numerous articles in the area of electronic packaging. He is a member of ASME, IEEE and SMTA.