CALCE Webinar - Additive Manufacturing for Planar Magnetics

Patrick McCluskey
Thursday, September 9, 2021 11:00 am US EDT


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There are strong incentives to reduce the size of advanced power electronics. Reduced system size often lowers parasitic losses, system weight, and system cost. Two items significantly limiting such reductions in size, however, are the following: 1) the dimension of magnetic devices such as transformers; and 2) the size of the cooling system, including heat sinks, required to dissipate the heat generated in the transformer windings. This webinar will discuss an advanced transformer configurations that allows for significant volume reduction by using additive manufacturing (AM) to deposit planar transformer windings on a thermally conductive combined-core-and-coil (C3) cooler substrate. The candidate material of the C3 cooler is ceramic, as it needs to be electrically insulating but thermally conductive. Windings are deposited on this cooler substrate by syringe printing and sintering of nano-silver (nano-Ag) and other conductive pastes, making the design flexible and sustainable. This paper will also detail the effect of the sintering process times and temperatures on electrical resistivity and adhesive bonding strength. Microstructural evolution in the sintered paste will also be addressed.

About the Presenter: Dr. Patrick McCluskey is a Professor of Mechanical Engineering at the University of Maryland, College Park and the Departmentís Design and Reliability of Systems Division Leader. He has over 25 years of research experience in the areas of thermal management, reliability, and packaging of electronic systems for use in extreme temperature environments and power applications. Dr. McCluskey has co-authored three books, 5 US Patents, and over 150 peer-reviewed technical articles with over 3000 citations. He is an associate editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technology, a member of the board of governors of the IEEE Electronic Packaging Society, a fellow and member of the Executive Council of IMAPS, and a member of ASME and AIAA.