CALCE Web Seminar - Reliability of 3D Integrated Embedded Cooling Structures

February 28, 2017 at 11:00 am US EST


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As package-level heat generation pushes past 1 kW/cm3 in various high power applications, new thermal management technologies are needed to maximize efficiency and permit advanced power electronic devices to operate closer to their inherent electrical limit. In an effort to align with the size, weight and performance optimization of high temperature electronics, cooling channels embedded directly into the backside of the chip or substrate significantly reduces junction-to-ambient thermal resistance by minimizing the number of thermal interfaces and distance the heat must travel. This presentation will discuss the reliability issues inherent in embedded microchannel cooling including particle erosion, erosion/corrosion, and clogging, along with the reliability of the techniques and materials used to integrate these coolers into the packaging, including substrates and attachments.

About the Speaker

Prof. Patrick McCluskey is a Professor of Mechanical Engineering at the University of Maryland, College Park. He is associated with the CALCE center where he is the principal investigator for projects related to packaging and reliability of electronic components for high power and high temperature environments. He is the author or co-author of over 100 technical articles on his research, and the co-author of three books. He has served as the technical program chair for several symposia and conferences in these research areas. He is a fellow of IMAPS and is a member of ASME, IEEE, and SAE.