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Lead free (LF) solders such as tin silver copper (SAC) and its variations are being used in microelectronic products for due the Restriction of Hazardous Substances regulation. In use, temperature cycling is a major contributor to the wear-out failure of solder joints during the life span of electronics. To predict the reliability of electronic solder joint, a fatigue life model of solder joint is needed. Currently, strain range and strain energy density based models are widely used for solder joint fatigue estimation. This presentation reviews existing LF solder fatigue models and provides model constants for strain range and strain energy based models.

About the Presenter: Dr. Michael Osterman is a senior research scientist and director of the CALCE Electronics Products and Systems Consortium. He has published extensively on solder interconnect reliability and modeling for electronic products. He also leads the development of the CALCE Simulation Assisted Reliability Assessment software. He is member a senior member of IEEE and a member of SMTA and ASME.