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CALCE Webinar - Solder Interconnect Fatigue Life Modeling and High Performance Pb-Free SoldersTuesday, September 15, 2020 11:00 am US EDT
About the Presenter: Dr. Michael Osterman is a senior research scientist and director of the CALCE Electronic Products and Systems Consortium. He has published extensively on solder interconnect reliability and modeling for electronic products. He also leads the development of the CALCE Simulation Assisted Reliability Assessment software. He is a senior member of IEEE and a member of SMTA and ASME. Related Papers Energy Based Modeling for Temperature Cycling Induced Tin Silver Copper Solder Interconnect Fatigue Life, Deng Yun Chen, Michael Osterman, and Abhijit Dasgupta; Microelectronics Reliability, April 2020, DOI: 10.1016/j.microrel.2020.113651. |
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