CALCE Webinar - Solder Interconnect Fatigue Life Modeling and High Performance Pb-Free Solders

Michael Osterman
Tuesday, September 15, 2020 11:00 am US EDT

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Solder interconnects, which provide both electrical and mechanical connections between package electrical devices and printed wiring boards, represent a reliability concern for electronic products. The ability to predict the lifetime of electronics products is important for warrant and logistics purposes. In use, temperature cycling is a major contributor to the wear-out failure of solder joints during the life span of electronics. Currently, strain range and strain energy density based models are widely used for solder joint fatigue estimation. This presentation reviews existing LF solder fatigue models and provides model constants for strain range and strain energy-based models. It will also review the reliability of 3rd Generation LF solders and propose models for a select number of the 3rd Generation LF solders.

About the Presenter: Dr. Michael Osterman is a senior research scientist and director of the CALCE Electronic Products and Systems Consortium. He has published extensively on solder interconnect reliability and modeling for electronic products. He also leads the development of the CALCE Simulation Assisted Reliability Assessment software. He is a senior member of IEEE and a member of SMTA and ASME.

Related Papers

Energy Based Modeling for Temperature Cycling Induced Tin Silver Copper Solder Interconnect Fatigue Life, Deng Yun Chen, Michael Osterman, and Abhijit Dasgupta; Microelectronics Reliability, April 2020, DOI: 10.1016/j.microrel.2020.113651.