Course Overview
This short course is intended to provide the audience with the current status of lead-free reliability and consideration of issues arising from the transition to lead-free assembled electronic hardware. The course provides up to date information on what companies should understand about lead-free materials, the reliability of lead-free assemblies, the risk posed by tin whiskers, as well as mixed solder reliability and rework and repair lead-based and lead-free assemblies.
Course Outline
1. Introduction
2. Lead-free Materials and Assemblies
3. Lead-free Assembly Reliability
- PWB Reliability
- Part Reliability
- Solder Interconnect Reliability
4. Mixed Solder and Rework and related issues
5. Tin Whiskers and Failure Risk
6. Summary
Past Customers
- Arbitron, Columbia, MD
- CEPREI - China
- Emerson Divisions - Missouri and China
- Emerson Electronics - Missouri
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- Halliburton - Texas
- L3 Electronic Systems - Canada
- Lockheed Martin - California, Georgia, Texas
- Schlumberger - Texas
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Related Texts
Contact
Michael Pecht
301-405-5323
education@calce.umd.edu
Bldg. 89, Room 1103
University of Maryland
College Park, MD 20742
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