Tuesday, June 25 |
Topic |
Speaker |
Opening Remarks
|
Diganta Das, Ph.D., CALCE |
Session 1 : Opening Session - Session 1: Opening Session – What Is Being
Counterfeited - Statistics? |
Impacts of Component Shortages and Obsolescence on Counterfeiting
|
Peter Panaguiton, GIDEP |
Changing Trends in Counterfeit and Nonconforming Reported Parts in the Electronics Supply Chain
|
Richard Smith, ERAI |
Counterfeit Alerts: Closing the Loop?
|
Vernon Densler, SiliconExpert |
Session 2 - Are the Standards Adequate to Protect You? |
SAE International Counterfeit Standards: A 2020 Vision
|
Judith Ritchie, SAE |
AS5553 Standard Update - Tools for Compliance with Federal Regulations
|
Robert Bodemuller, Lockheed Martin Corporation |
Supply Chain Risk Mitigation Through Compliance Verification
|
Jim Lewis, Performance Review Institute |
Leveraging Synergies Between IPC1782, IPC2581, and IPC2591 to Mitigate the Risks of Counterfeits
|
Cameron Shearon, Raytheon IDS |
|
Session 4 - Physical/Inspection/Tagging |
Counterfeit and Rewrapped Lithium-ion Batteries in Market and Their Relationship with the Supply Chain
|
Diganta Das, Ph.D., CALCE/University of Maryland |
Can AI Help Us in the Fight Against Counterfeit Components?
|
Bill Cardoso, Ph.D., Creative Electron, Inc.
|
Cu Bond Metal Decap via Wet-etching & Dry-etching Processes
|
Erik Jordan, Nisene |
Provenance Management: Balancing the Four-legged Stool
|
Daniel Stanton, SecureMarking Inc., and Mark Manning, iTrace Technologies, Inc. |
Wednesday, June 26 |
Session 5 - Process Concerns |
Prosecution of Counterfeiters: A Case Study of the Process: U.S. v. Rogelio Vasquez
|
Brian Resler, Assistant Deputy Chief for Litigation, Computer Crime, and Intellectual Property Section, USDOJ |
Comparison of Clone and Authentic Altera Serial Configuration Devices
|
Nicholas Williams, Ph.D., SMT Corp |
Case Study: Implementing a Counterfeit Electronic Parts Avoidance and Detection Policy from the Ground Up
Media File 1 Media File 2 Media File 3 |
Jeff Hallman, Georgia Tech Research Institute |
Session 6 - Cyber Physical System Security |
Addressing the Need for Cross-industry Collaboration for Cyber-physical Systems Security
Call to Action |
Dan DiMase, Aerocyonics
|
Microelectronics Threats
|
Glen Berger, US Navy
|
Avoidance of Vulnerable and Tampered Parts Through Hardware Assurance
|
John Hallman, OneSpin
|
An Ounce or Teaspoon of Paranoia?
|
Doug Britton, RunSafe Security Inc.
|
Session 7 - Bringing Information Security in the Solution
Space |
Blockchain – A CBP Perspective
|
Marie Williams, Branch Chief, Innovation, U.S. Customs and Border Protection
|
Blockchain in Electronics Supply Chain for Part Provenance and Traceability
|
Curtis Grosskopf, IBM
|
Reducing the Fake Electronic Component Ingress Using Blockchain
|
Radu Diaconescu, Swissmic SA
|
Session 8 - Technology Solutions |
Tamper-evident e-Seal
|
Richard McDermott, Ph.D., SIGNAKEY
|
Native Characteristics of Electronic Components for Identification and Authentication
|
David Ross, Ph.D., Alitheon
|
DUST: How Nano-Diamonds Prevent Counterfeits in Global Supply Chains
|
Ophir Gaathon, Ph.D., DUST Identity
|
Closing Remarks and Summary: Where Do We Stand and Where Do We Go from Here?
|
Diganta Das, Ph.D., CALCE/University of Maryland
|