Parrish Ralston is currently employed at Northrop Grumman as a RF/Microwave Designer where she is the principal investigator on DARPA SHIELD program. She is also involved with the development of 3D fabrication processes, design and assembly of carbon nanotube amplifiers and packaging and modeling and characterization for GaAs, GaN, and SiGe technologies. She has also worked as a Graduate Researcher at Virginia Tech for about 6.5 years where she engaged in design, fabrication, test, and verification of liquid metal, flip chip interconnections for heterogeneous microwave and mm-wave assemblies. She has pursued BS, Electrical Engineering from Virginia Tech followed by MS, Electrical Engineering/Power Electronics and MS, Electrical Engineering/Power Electronics.
Len Chorosinski received his B.S.M.E. in 1980 from the University of Illinois at Urbana-Champaign and is a Consulting Engineer for Northrop Grumman's Mission Systems Sector based in Baltimore, MD. Len has over 35 years of experience at Northrop Grumman in electronics and microelectronics packaging design, analyses, manufacturing, and reliability testing; supporting the conceptualization, design, development, manufacture and test of materials, components, subsystems and systems for a wide variety of Northrop Grumman's military electronics products. He has over twenty-five technical publications, multiple Trade Secret Awards, four New Technology Awards, one Patent Award, and five patent applications currently filed and in process. He presently works in the Mechanical Technology department, supporting anti-tamper technology projects, advanced electronics packaging development, and is a principal lead in the sector's additive manufacturing for electronics initiative.
Under the DARPA/MTO SHIELD program, a Northrop Grumman led team is developing a hardware and software system to protect against the growing threat of counterfeit electronic parts. The foundation of our SHIELD solution is an advanced 100µm x 100µm x 20µm near-field RFID "dielet" fabricated on 14nm CMOS. This dielet, which is targeted to cost about 1 cent, will be embedded in a host component's packaging and provides a hardware root-of-trust through the integration of advanced key protection and cryptographic techniques. The authenticity of an electronic component can be checked and verified using an RF probe to energize and read the dielet, retrieving component data from a centralized secure database over an internet connection.
This research was developed with funding from the Defense Advanced Research Projects Agency (DARPA). The views, opinions and/or findings expressed are those of the author and should not be interpreted as representing the official views or policies of the Department of Defense or the U.S. Government.
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