CalceSARA Software Presentations and Reports


Physics of Failure Based Reliability Assessment of Electronic Hardware, Sandeep Menon, Elviz George, Michael Osterman and Michael Pecht, 6th Annual World Congress on Engineering Asset Management, Cincinnati, Ohio, USA, 2-5 October, 2011.
Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications, E. George, D. Das, M. Osterman, and M. Pecht, Device and Materials Reliability, IEEE Transactions on , vol.11, no.2, pp.328-338, June 2011.
Modeling Temperature Cycle Fatigue Life of SN100C Solder, M. Osterman, 2011 SMTA International Conference on Soldering and Reliability, Toronto Canada, May 3-4, 2011.
Physics of Failure Based Virtual Testing of Communication Hardware, Elviz George, Diganta Das, Michael Osterman, and Michael Pecht, ASME International Mechanical Engineering Congress and Exposition, Lake Buena Vista, Florida, US, 13-19 Nov, 2009.
Effect of temperature cycling parameters on the durability of Pb-free solders, M. Osterman and P. Chauhan, IMAPS 2009 42nd International Symposium on Microelectronics, San Jose Convention Center - San Jose, California, USA, November 1-5, 2009.
Life Expectancies of Pb-free SAC Solder Interconnects in Electronic Hardware, M. Osterman and A. Dasgupta, Lead-free Electronic Solders, A Special Issue of Journal of Materials Science: Materials in Electronics,, Springer, pp. 229-236, 2007.
Strain Range Fatigue Life Assessment of Lead-free Solder Interconnects Subject to Temperature Cycle Loading, M. Osterman and M. Pecht, Soldering & surface Mount Technology, Vol. 19, No. 2, pp. 12-17, 2007.
Tin Whisker Risk Assessment, T. Fang, M. Osterman, S. Mathew, and M. Pecht, Circuit World, Vol. 32, No. 3, pp 25-29, May. 2006.
Failure Analysis and Virtual Qualification of PBGA Under Multiple Environmental Loadings, H. Qi, C. Wilkinison, M. Osterman, and M. Pecht, Electronic Components and Technology Conference, Proceedings. 54th, Vol, 1. No. 1-4, pp. 413-420, June 2004.