Electronic Components and Technology Conference, Proceedings. 54th, Vol, 1. No. 1-4, pp. 413-420, June 2004

Failure Analysis and Virtual Qualification of PBGA Under Multiple Environmental Loadings

H. Qi, C. Wilkinison, M. Osterman, and M. Pecht
University of Maryland
College Park, MD 20742


To investigate the long term reliability of plastic ball grid array packages in aerospace application, a design of experiments was conducted to address assembly process, primed circuit board pad type, underfill, and multiple environmental loadings. This paper discusses the design of experiments and the test results, including the failure analysis. Virtual qualification was also performed to simulate the solder joint reliability under thermal cycling and vibration loadings.

Complete article is available to CALCE Consortium Members.


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