| | | | | | CALCE June Webinar: Thermal Cycling Fatigue of Additively Fabricated Conductive Silver Traces |
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| Additive manufacturing provides a pathway for producing printed hybrid electronic (PHE) assemblies in novel form factors, combining conventionally manufactured components with additively manufactured features. Aerosol jet printing (AJP) is one of the leading methods for PHE. This talk examines the thermomechanical fatigue reliability of sintered silver nanoparticle conductors in AJP electronics under temperature cycling across three substrate platforms: glass-FR4, Kevlar-epoxy, and aluminum nitride ceramic. …
Presented by: Prabhat Janamanchi Tuesday, June 16, 2026
11:00 am US Eastern |
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| | | Registration is Now Open for CALCE/SMTA Counterfeit Symposium - June 23-25, 2026 |
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Join us at College Park in June for this exciting event.
The technical program includes counterfeit avoidance and testing standards, applications of AI in inspection and tracking, decision-making regarding counterfeit, and more. The symposium will host two panel discussions: one focused on the suite of international standards and another examining the renewed challenge of component allocations and long lead times. |
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| | | Professional Development Courses at CALCE/SMTA Counterfeit Symposium |
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At the 2026 SMTA/CALCE Symposium on Counterfeit Parts and Materials, a full day of professional development courses will be offered on June 25, 2026. The courses are: “Understanding and Implementing Industry Standards for Counterfeit Avoidance”, “How to Make the Best Use of 2026 Updates to SAE AS6171,” and “Electronic Part Obsolescence Forecasting, Mitigation, and Management.” |
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Dr. Diganta DasUnderstanding and Implementing Industry Standards for Counterfeit Avoidance |
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Dr. Michael AzarianHow to Make the Best Use of 2026 Updates to SAE AS6171 |
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Prof. Peter SandbornElectronic Part Obsolescence Forecasting, Mitigation, and Management |
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| | | | | | | Prof. Michael Pecht Ranked Among Top Mechanical and Aerospace Engineering Scientists for 2026 |
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| Research.com has ranked Professor Michael Pecht, Founding Director of CALCE, among the top scientists in its 2026 Best Mechanical and Aerospace Engineering Scientists Ranking. Professor Pecht was ranked No. 40 in the world and No. 21 in the United States.
Dr. Pecht’s recognition reflects his long-standing contributions to reliability engineering, prognostics and health management, electronics reliability, battery safety, and risk assessment. His work through CALCE has helped advance research, standards, and industry practices in the reliability and safety of electronic systems. Together, this recognition highlights the continued impact of CALCE research and Dr. Pecht’s leadership in electronics reliability and advanced system safety. |
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IMAPS Chesapeake and UMD Student Chapter Meeting |
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| IMAPS (International Microelectronics Assembly and Packaging Society) is a global non-profit association dedicated to advancing microelectronics and electronics packaging. The Chesapeake Chapter of IMAPS, which includes members from Northern Virginia, Washington, D.C., Maryland, and Delaware, hosted a joint technical meeting in collaboration with the University of Maryland student chapter. The program included technical talks, student thesis presentations, and a membership drive. |
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| | | | CALCE Seminar: Failure Investigation of the First Large Lithium-ion Battery Used in Aircraft |
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| Dr. Jeevarajan brings nearly 30 years of experience in battery safety research, with expertise in lithium-ion and sodium-ion chemistries, thermal runaway and propagation, battery fire characterization, recycling, flow battery safety, and hydrogen safety. She also serves on technical working groups for several standards organizations, including ULSE, SAE, IEC, the UN Informal Working Group, and AIAA, and chairs the IEC SC21A subcommittee on battery standards. The lecture highlighted the importance of detailed failure investigation to identify root causes, inform improved battery designs, and guide the development of more effective testing and safety protocols for lithium-ion battery systems, as they are increasingly used in transportation, aerospace, and other high-performance applications. |
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| | | | A Review of Float Charging in Lithium-Ion Batteries: Degradation Mechanisms, Influencing Factors, and Optimization Strategies |
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Lithium-ion batteries (LIBs) are increasingly being used in backup energy storage applications such as on-grid substations and solar systems, where maintaining a full state of charge is essential to ensure immediate availability and delivery of rated capacity. As a result, float charging, which involves supplying a low, continuous current to maintain the battery's charged potential and counteract self-discharge, is used to ensure batteries remain fully charged. However, prolonged float charging can lead to battery degradation caused by electrolyte decomposition, deposition of metallic lithium, and structural changes of the electrodes, compromising battery lifespan, performance, and safety. … |
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| | | Reliability Analysis of a Microinverter Prototype: A Case Study on Sn-Ag-Cu Solder Under Thermal Fatigue for Encapsulated GaN Packages |
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| A single-stage dual-active-bridge direct current-alternating current (DC-AC) micro-inverter prototype with Gallium Nitride (GaN) primary switching devices was assembled and subjected to environmental reliability testing. Testing consisted of an unpowered temperature cycling with an amplitude ranging from −40 °C to 105 °C. Electrical performance characterization was performed during the accelerated testing at regular intervals until a failure was observed. … |
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| | Novel Test Method to Measure Time-cure Superposition Shift Factors of Filled-Thermoset Under Isocure Testing Conditions |
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| Despite the solid theoretical foundation of time-cure superposition, the time-cure superposition (TCS) shift factors reported in the literature do not support the theory very well. The discrepancy stems from the non-isocure test conditions used in the tests. This study proposes a novel method to eliminate the inherent problems of existing techniques to measure the TCS shift factors, i.e., to measure them under isocure test conditions. … |
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| | | Predicting Redistribution Layer (RDL) Interfacial Strength and Delamination In Fan-Out Wafer Level Packaging |
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As advanced packaging demands higher interconnect density, Redistribution Layer (RDL) technologies must accommodate progressively smaller line widths and tighter spacing. However, this scaling intensifies reliability challenges, making ultrafine RDLs highly vulnerable to progressive crack growth and delamination. … |
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| | Effect of Underfill Interfacial Delamination on Reliability of Advanced Electronic Packages |
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Real-time, high-throughput applications such as AI/ML and connected vehicles require advanced packaging with heterogeneous integration for high performance and thin form factors. Underfills delaminate or crack due to interfacial stresses and stress concentrations, motivating modeling approaches to capture resulting failure modes and effects. … |
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| | Learn moreThe CALCE website provides a list of CALCE publications, webinars, symposia, and more Read More → |
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| | Please share this email with your colleagues who may be interested. They can also subscribe to the CALCE mailing list here → |
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