| | | | | | CALCE June Webinar: Thermal Cycling Fatigue of Additively Fabricated Conductive Silver Traces |
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| Additive manufacturing provides a pathway for producing printed hybrid electronic (PHE) assemblies in novel form factors, combining conventionally manufactured components with additively manufactured features. Aerosol jet printing (AJP) is one of the leading methods for PHE. This talk examines the thermomechanical fatigue reliability of sintered silver nanoparticle conductors in AJP electronics under temperature cycling across three substrate platforms: glass-FR4, Kevlar-epoxy, and aluminum nitride ceramic. …
Presented by: Prabhat Janamanchi Tuesday, June 16, 2026
11:00 am US Eastern |
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| | | CALCE/SMTA Counterfeit Parts and Materials Symposium - June 23-25, 2026 |
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Join us in College Park for the CALCE/SMTA Counterfeit Parts and Materials Symposium.
The symposium will have technical presentations from organizations including NASA, Astute Electronics, Raytheon, SMT Corp., Cadence, ERAI, and others. Topics include counterfeit avoidance standards, AI-enabled inspection and traceability, detection case studies, supply chain risk, and decision-making in counterfeit mitigation.
The program will feature a panel discussion on the era of allocation of components with long lead times, moderated by Kevin Sink of TTI. Global capacity is prioritized for new technologies, high-volume, continuous-demand customers, and higher-margin products, leaving other segments starved for capacity. This panel will share information from industry experts from the frontline and propose ways to manage your organization's sourcing in these environments. |
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| | | Professional Development Courses at CALCE/SMTA Counterfeit Symposium |
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At the 2026 SMTA/CALCE Symposium on Counterfeit Parts and Materials, a full day of professional development courses will be offered on June 25, 2026. The courses are: “Understanding and Implementing Industry Standards for Counterfeit Avoidance”, “How to Make the Best Use of 2026 Updates to SAE AS6171,” and “Electronic Part Obsolescence Forecasting, Mitigation, and Management.” |
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Dr. Diganta DasUnderstanding and Implementing Industry Standards for Counterfeit Avoidance |
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Dr. Michael AzarianHow to Make the Best Use of 2026 Updates to SAE AS6171 |
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Prof. Peter SandbornElectronic Part Obsolescence Forecasting, Mitigation, and Management |
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| | | | | | | Prof. Michael Pecht Conducts Study on Reliability and Risk in Space-Based Data Centers |
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The rapid expansion of artificial intelligence and cloud computing is straining terrestrial data center infrastructure, motivating exploration of space-based data centers as a scalable and energy-efficient alternative. While orbital platforms offer unique advantages, including continuous solar energy, radiative cooling, and global coverage, their practical deployment is constrained by unresolved reliability challenges across the mission lifecycle. An article on this topic, “Reliability and Risk in Space-Based Data Centers: A Lifecycle Assessment of Orbital Cloud Infrastructure,” is published in Applied Sciences. |
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Amir Tari from the University of Maryland Presents at the IEEE ITherm Conference |
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Amir Hossein Zabihi Tari, a Ph.D. student in Mechanical Engineering at the University of Maryland, presented his work on evaluating the reliability and availability of hybrid thermal management systems for data centers. The talk focused on liquid/air-cooled architectures, failure mechanisms, preventive maintenance, and strategies for reducing downtime. Conducted with the Smart and Small Thermal Systems Laboratory and CALCE, the work provides a framework for improving the long-term performance and reliability of modular edge micro data center cooling systems. |
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| | | | Prof. Michael Pecht Ranked Among Top Mechanical and Aerospace Engineering Scientists for 2026 |
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| Research.com has ranked Professor Michael Pecht, Founding Director of CALCE, among the top scientists in its 2026 Best Mechanical and Aerospace Engineering Scientists Ranking. Professor Pecht was ranked No. 40 in the world and No. 21 in the United States.
Dr. Pecht’s recognition reflects his long-standing contributions to reliability engineering, prognostics and health management, electronics reliability, battery safety, and risk assessment. His work through CALCE has helped advance research, standards, and industry practices in the reliability and safety of electronic systems. Together, this recognition highlights the continued impact of CALCE research and Dr. Pecht’s leadership in electronics reliability and advanced system safety. |
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| | | Professor Jay Lee to Chair New ASTM International Committee on AI in Manufacturing Systems |
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ASTM International’s board of directors has approved the creation of a new technical committee, F50, on artificial intelligence (AI) in manufacturing systems, chaired by Professor Jay Lee, Clark Distinguished Professor and director of the Industrial AI Center at the University of Maryland, College Park. The committee will focus on frameworks, best practices, and standards for the use of AI technologies in manufacturing. |
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| | | | | An Attentional Deep Learning Model Based on Improved Crested Porcupine Optimizer for State of Health Prediction of Lithium-Ion Batteries |
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This paper aims to accurately predict and effectively manage the state of health (SOH) of lithium-ion batteries to maximize their utilization. Traditional SOH prediction models based on deep learning frequently encounter issues like inadequate representation capabilities of health features (HFs) and improper hyper-parameter settings. … |
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| | Characterization of Young’s and Bulk Equilibrium Modulus Evolution of Filled Thermoset During Curing |
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The cure-extent dependent viscoelastic behavior of filled thermosets remains a critical issue in high-temperature manufacturing, particularly in advanced semiconductor packaging. This paper presents a novel method for characterizing the evolution of the Young's equilibrium modulus and bulk equilibrium modulus during curing, the properties essential for accurately describing cure-dependent behavior. … |
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| | | Parametric Assessment of Cu Pillar Microbump Interconnects Co-Design for Thermomechanical Reliability |
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Copper pillar μbumps are increasingly being used in heterogeneously integrated semiconductor packages as first-level interconnects to achieve higher interconnect densities than traditional solder bumps. The role of thermomechanical reliability in the co-design process of Cu-pillar microbumps has therefore received increased scrutiny in the literature. … |
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| | Modelling Framework to Capture Differences in Anisotropy Between Primary and Secondary Creep Deformation in Solder Interconnects During Rapid Temperature Excursions |
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| Electronics packaging increasingly relies on heterogeneous integration with high-density solder interconnects, where the thermomechanical reliability depends strongly on the creep behavior of solder alloy under varying thermal cycling ramp rates. The small length scale results in oligocrystalline joints whose deformation depends on grain-scale anisotropic mechanics. This study develops a continuum-scale anisotropic framework to predict variability of SAC305 solder joint deformation during different loading conditions. … |
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| | Learn moreThe CALCE website provides a list of CALCE publications, webinars, symposia, and more Read More → |
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| | Please share this email with your colleagues who may be interested. They can also subscribe to the CALCE mailing list here → |
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