On Wednesday, October 25, 2023 and Thursday October 26, 2023, the Center for Advanced Life Cycle Engineering conducted its bi-annual Reliability Science symposium and research planning meetings. This meeting was a hybrid meeting at the University of Maryland and virtually via Zoom. The meeting will include an overview of CALCE research activities with several detailed research project presentations. The meeting materials are open to all CALCE members with CALCE Web Accounts.

If you are interested in CALCE membership, please contact Dr. Osterman. For non-CALCE organizations interested in attending, please contact Dr. Osterman.

View Presentations and Provide Feedback - Session 1

8:45 am - Introductions

9:00 am - Opening Presentations I

Solder Performance and Reliability Assurance Project Keynote Speaker: Dr. Michael Osterman

9:30 am - Session I

	Fatigue under Multiaxial Cyclic Creep and Plasticity in Oligocrystalline SAC Solder Joints (Members' Only)
	Reliability of 3rd Generation Lead-free Solder Interconnects (Members' Only)
	Reliability of Low Temperature Solder Interconnects (Members' Only)
	Board Level Reliability Assessment of Bi-based Hybrid Low Melting Solder as a Function of Bi Diffusion (Members' Only)

11:00 am - Session II

View Presentations and Provide Feedback - Session 2

	Diamond Electronics, For High Temperature, High Power Applications (Members' Only)
	Component Selection for Use Beyond Specifications(Members' Only)
	Component Life Assessment Methodology Development (Members' Only)
	Discrete Component Qualification Methods (Members' Only)

1:30 pm - Session III

View Presentations and Provide Feedback - Session 3

	Selection Criteria for Use of Multilayer Ceramic Capacitors (MLCCs) with Ripple Current Loading Conditions (Members' Only)
	Quality and Reliability Benefits of AEC-Q200 Class II X7R Multilayer Ceramic Capacitors (MLCCs) (Members' Only)
	Evaluation and Selection of Lubricants for Mechanical Interfaces (Members' Only)
	Paint Adhesion Reliability (Members' Only)

3:30 pm - Session IV

View Presentations and Provide Feedback - Session 4

	Reliability of Printed RF circuits under Temperature Cycling, THB and Vibration Conditions (Members' Only)
	Creep Properties of Sintered Silver Conductors and Interconnects(Members' Only)
	Extreme Drop Durability of Printed Hybrid Electronics (Members' Only)
	A Protection-Level Preservation Based Additive Manufacturing System Life-Cycle Model (Members' Only)
	Swelling Tests for Li-Batteries (Members' Only)
	Rapid Assessment of Electronic Products Using Side-Channel Analysis(Members' Only)

9:00 am - FY24 Research Projects

Project Development Process

Projects and Feedback

Member Discussions