C24-10 Development of Advanced Board Level Reliability Prediction Model for Power Devices under Autonomous Driving Condition High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C24-26 Paint Delamination and Scratch Resilience for Electronic Products High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C24-03 Effect of Aging and Recrystallization on Performance of Oligocrystalline SAC Solder Joints High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C24-19 Evaluation of Multilayer Ceramic Capacitors (MLCCs) for Use with Ripple Current (Continuation of C23-19) High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C24-22 Fretting Wear and Lubrication of Polymer/Metal Contacts (Continuation of C23-22) High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C24-25 Development of a PHM Methodology for Printed Circuit Board Assemblies High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C24-15 Development of Derating Guidelines for Lithium Ion Batteries High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C24-07 Reliability of 3rd Generation Lead-free Solder Interconnects High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C24-08 Reliability of Low Temperature Solder Interconnects High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions: