Microelectronics Reliability, April 2020, DOI: 10.1016/j.microrel.2020.113651

Energy Based Modeling for Temperature Cycling Induced Tin Silver Copper Solder Interconnect Fatigue Life

Deng Yun Chen, Michael Osterman, and Abhijit Dasgupta
CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20742, USA


Lead free (LF) solders such as tin silver copper (SAC) and its variations have been used in microelectronic products for the past decade due the Restriction of Hazardous Substances regulation. In use, temperature cycling is a major contributor to the wear-out failure mechanisms of solder joints during the life span of electronics. To predict the reliability of electronic solder joints, a fatigue life model is needed. Currently, strain energy density based models are widely used for solder joint fatigue life estimation. This paper reviews existing LF solder fatigue life models and provides strain energy based life model constants for a variety of LF solder materials.

This article is available online here and to CALCE Consortium Members for personal review.

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