Slide Deck (pdf)

Recorded Presentation (mp4)

This webinar is aimed at decision-makers with responsibility for the reliability and sustainability of their DoD electronic systems. Unintended/uncontrolled introduction of lead-free electronic parts and assemblies has negatively impacted the DoD in systems. The DoD has unique harsh environment long life systems needs and owns equipment longer than some companies exist. To help the DoD maintain low systems risk while leveraging low cost available commercial-off-the-shelf (COTS) electronics, the Strategic Environmental Research and Development Program (SERDP) and the Environmental Security Technology Certification Program (ESTCP) have established lead-free solder research programs. Fatigue life requirements and failure consequences vary greatly over different DoD applications and lead-free solders are not form-fit-function replacements for heritage tin-lead solders. The transition from tin-lead solder to Lead-free solder requires adjustments to design rules, fatigue modeling, qualification testing to counter the effects of lead-free solder joint aging, interfacial fractures modes, and printed circuit board pad cratering failures. The lead-free solder microstructural evolution and its impacts on fatigue testing and modeling will be reviewed. The present discussion will focus on tin-silver-copper (Sn-Ag-Cu), the current mainstream surface mount lead-free alloy. Systems Engineering specifications must require interconnect material configuration control, have a clear understanding the new lead-free material set(s) performance, develop a consensus on the analysis/test protocols needed to validate their performance, and establish a sustainment/repair logistics plan.

This presentation is the second in a three part series and follows the “DoD Program Managers Lead-free Overview webinar” available at http://www.calce.umd.edu/seminars/PM-LF-Webinar-2016-10-12.htm. The tin whisker risk webinar will follow in the coming months.

Topics Covered:

• Lead-free interconnect failure modes
• Lead-free assembly testing
• Modeling vibration
• Modeling thermal cycling and lead-free solder creep
• Realistic service: Combining thermal cycling and vibration
• Environmental screening considerations
• Support resources

About the presenters:

Peter Borgesen earned a PhD in Physics from University of Aarhus in Denmark, worked at national laboratories there and in Germany, and came to the US in 1986 to work in the Materials Science department at Cornell University. In 1994 he was recruited by Universal Instruments to manage a multi-million dollar process research effort funded by an international consortium of companies from across the electronics industry. After 15 years he left to join Binghamton University (SUNY) where he is a professor of Systems Science & Industrial Engineering and a member of the Materials Science program. Dr. Borgesen served as a subject matter expert on phase I and II of the 2009 Lead-free Manhattan Project sponsored by Office of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel (JDMTP). He is a principle investigator on SERDP program WP-1751.

Indranath Dutta is Professor of Mechanical and Materials Engineering at Washington State University (WSU), where he also served as Director of the Materials Science and Engineering Program during 2010-2014 and Associate Dean of the College of Engineering and Architecture during 2011-2013. He received a B. Tech. from the Indian Institute of Technology (Kharagpur) in 1983, a M.S. from Case Western Reserve University in 1985, and a PhD from the University of Texas at Austin in 1988. Prior to joining WSU, he was Professor of Materials Science and Mechanical Engineering at the Naval Postgraduate School (1988-2008). He has held visiting positions at the Air Force Research Laboratory (1995), the University of Oxford (1996), MOTOROLA (2000), INTEL Corporation (2001), and Nanyang Technological University, Singapore (2008). He is a Fellow of ASM International. Prof. Dutta's current research is in the area of multi-physics phenomena in multi-component materials systems, with emphasis on materials for microelectronics and meso-to-nanoscale electrically-activated manufacturing processes. He is a principle investigator on SERDP program WP-1751.

Stephan Meschter is an engineer at BAE Systems Electronic Systems Division in Endicott, NY. He earned a PhD in Mechanical Engineering from Binghamton University and has 30 years of experience in advanced electronic packaging, failure analysis, and reliability testing at BAE Systems and its heritage companies (General Electric, Martin Marietta and Lockheed Martin). He has designed and evaluated electronic assemblies for power control, flight control and jet engine control systems used in spacecraft, aircraft and ground vehicles. Dr. Meschter served as a subject matter expert on phase I and II of the 2009 Lead-free Manhattan Project sponsored by Office of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel (JDMTP). Dr. Meschter is the principle investigator of two U.S. DoD Strategic Environmental Research and Development Projects (SERDP) that are examining corrosion induced whisker growth (WP1753) and conformal coatings for whisker mitigation (WP2213).

Michael Osterman (Ph.D., University of Maryland, 1991) is a Senior Research Scientist and the director of the CALCE Electronic Products and System Consortium at the University of Maryland. He heads the development of simulation assisted reliability assessment software for CALCE and simulation approaches for estimating time to failure of electronic hardware under test and field conditions. Dr. Osterman served as a subject matter expert on phase I and II of the 2009 Lead-free Manhattan Project sponsored by Office of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel (JDMTP). He has consulted with automotive, medical, defense, and industrial electronic companies on the transition to lead-free materials. He organized and chaired the International Symposium on Tin Whiskers from 2007 to 2015. He has written eight book chapters and over 120 articles. He is a senior member of IEEE and a member of ASME, IMAPS and SMTA.