Slide Deck

Recorded Presentation

This webinar is aimed at decision-makers with responsibility for the reliability and sustainability of their DoD electronic systems. The slides present examples of the kinds of issues that your team will encounter as the lead-free electronic solder and lead-free materials impact your program. Lead-free materials introduce three distinct problems; (1) an escalation of acquisition and sustainment cost, (2) increased failure risk due to tin whiskers (unless mitigated), and (3) a need to develop a clear understanding the new lead-free material set(s) performance and a consensus on the test protocols needed to validate their performance. The DoD has unique harsh environment long life systems needs and owns equipment longer than some companies exist, but has benefited greatly from low cost available commercial-off-the-shelf electronics. The DoD Strategic Environmental Research and Development Program (SERDP) and the Environmental Security Technology Certification Program (ESTCP) have established lead-free solder research programs to help reduce DoD program risk.

The lead-free issues propagate throughout the entire product life cycle from concept design through end of life. All of them, including ones deep in the supply chain, must be addressed to achieve optimal program success. The presentation highlights the need for increased team awareness and improved systems engineering practices to address risks. Additional webinars providing more in-depth discussions on lead-free solder reliability and tin whisker risk will follow in the coming months.