Lead-Free and Green Electronics Forum
Current Issues | Legislation | Projects | Services | Training| Publications | Presentations- Nonlinear Fatigue Model for Variable Temperature and Vibration in SAC Assemblies
- Considerations for Implementing RoHS Compliant Electronics for Critical Applications
- Evaluation of Temperature Cycling and Corrosion Resistance on Assemblies with Tin Mitigation Coatings
- Evaluation of Select Tin Whisker Mitigation Coatings and Low Temperature Reflow Solder on Interconnects under Vibration and Drop
- Damage State Estimation in Solder Interconnects under Sequential Loading Conditions
- Impact of Extended Dwells on Solder Interconnect Reliability of Next Generation Solders
- PoF Models for Combined Vibration Fatigue and Temperature Cycling in SAC Assemblies
- Effect of Au, Ni and Cu on Integrity of SAC Solder Joints
- Electrical Characteristic of Vapor Arcing by Metal Whiskers
- Evaluation of New Coating for Whisker Mitigation
- Damage State Estimation in Solder Interconnects under Sequential Loading Conditions
- Impact of Extended Dwells on Solder Interconnect Reliability of Next Generation Solders
- PoF Models for Combined Vibration Fatigue and Temperature Cycling in SAC Assemblies
- Evaluation of Gold Content on SAC Solder Reliability
- Electrical Characterization of Tin and Zinc Whiskers
- Modeling Solder Interconnect Fatigue for Complex Temperature Cycles
- Evaluation on ENEPIG Finish under Temperature Cycling and Drop Loading
- Evaluation of Solder Interconnects on ENEPIG under Vibration Loadin
- Impact of Extended Dwells on Solder Interconnect Reliability of Next Generation Solders
- PoF Models for Combined Vibration Fatigue and Temperature Cycling in SAC Assemblies
- Influence of Aging on Viscoplastic Behavior and Fatigue Durability of SAC105X
- Whisker Farm Growth Measurements
- Electrical Apects on Tin Whisker Failures
- PoF Model of Conformal Coating against Tin Whisker Growth: Performance Evaluation under Operating and Storage Conditions
- Impact of Power Cycling on Lead-free Solder Reliability
- Evaluation of new printed wiring board finishes ENEPIG
- Vibration Fatigue Life of Solder Interconnects in BGA and Package on Package Assemblies
- Impact of Extended Dwells on Solder Interconnect Reliability of new Low Silver Lead-free Solders
- Viscoplastic Behavior and Fatigue Constants for SAC105 Solder
- Assessment of Tin Whisker Arcing Potential
- Tin Whisker Growth on Conformally Coated SnPb Assemblies
- Long Term Reliability Evaluation of Conformal Coats for Tin Whisker Migration
- Power Cycling on Lead-free Solder Interconnects
- Impact of Electric Current and Thermal Aging on Lead-free Solder Interconnection formed on ENIG finished Printed Wiring Boards
- Long-term Vibration Fatigue Life of Pb-free Interconnects
- Maintenance Data Analysis and its Use in Supporting the Lead-Free Repair Simulation and Decision Making
- Impact of Extended Dwell on Solder Interconnect Reliability
- Evaluation of Conductive Filament Formation in RoHS Environments
- PoF Models for Vibration Fatigue Mechanisms in SAC Assemblies at Different Temperature
- TMM Testing of SAC105 Solder
- Evaluation of Conformal Coat for Tin Whisker Mitigation
- Effectiveness of Tin Whisker Removal and Impact of Corrosion on Whisker Growth
- Tin Whisker Properties and Failure Mitigation Offered by Conformal Coats
- Solder Joint Reliability of Reprocessed Part and Reworked/Repaired SMT Assemblies
- Role of High Current on Solder Interconnect Reliability Under Temperature Cycling
- Vibration Fatigue Life of Pb-free Interconnects
- Lead-Free Electronics Use and Repair Dynamic Simulation
- Electrochemical Migration of Pb-free Printed Circuit Boards with Through-Hole and Surface Mount Components
- Reliability of Pb-free and Reballed PBGAs in SnPb Assembly Process
- Effect of Cyclic Fatigue Damage Accumulation on Properties of SAC Solders
- Solder Joint Reliability of Solder Dipped SAC/SnPb and SnBi Leaded SMT Packages in a Sn37Pb Assembly Process
- Tin Whisker Shorting Propensity and Growth Assessment
- Solder Joint Reliability of Reworked/Repaired SMT Assemblies
- Thermal Aging Effect on Reliability of Pb-free Interconnects Sn96.5Ag3.0Cu0.5 and SnCuNi
- Vibration Fatigue Life of Pb-free Interconnects Sn96.5Ag3.0Cu0.5 and SnCuNi
- Characterization of Halogen free PCB Laminate Materials
- Lead Free Synthesis
- Mitigation Measures for Electrochemical Migration on Lead-Free Assemblies with Low-Profile Components
- Lead-free Solders in High Temperature Application
- Reliability of Pb-free and Reballed PBGAs in SnPb Assembly Process
- Accelerated Qualification of SAC Assembly: Combined Temperature Cycling & Vibration
- Effect of Long Dwell on Thermal Cycling Fatigue Damage for Pb-Free Solders
- Solder Joint Reliability of Solder Dipped SAC/SnPb Leaded SMT Packages in a SnPb Assembly Process
- Tin Whisker Growth and Risk Assessment Update
- Effect of Temperature Cycle on the Durability Pb-free Interconnects Sn96.5Ag3.0Cu0.5 and SnCuNi
- Solder Joint Reliability of Reworked/Repaired SMT Assemblies
- Characterization of Tin Pest Formation in Pb-free Solder Joints
- Implementation Cost of Lead-Free and Tin Whisker Mitigation Performance Standards
- Characterization of PCB Laminate Materials Properties after Lead-free Reflow Cycles
- Acceleration factors in electrochemical migration
- High Temperature Reliability of Lead Free Solders
- Effect of Manufacturing Variability on Reliability of Lead Free Solder Joints
- Accelerated Qualification of SAC Assembly: Combined Temperature Cycling & Vibration
- Effect of Characteristic Relaxation Time on Accelerated Thermal Cycling Profiles for SAC Solders
- Effect of Load Sequencing on Pb-free Solder Durability
- Effect of Temperature Cycle on the Durability Pb-free Interconnects (Sn96.5Ag3.0Cu0.5 and SnCuNi)
- Characterization of Tin Pest Formation in Pb-free Solder Joints
- Development of Vapor Pressure Modeling Scheme for PEMs subjected to Pb-free Solder Reflow Profile
- Development of CFF Model for Today’s PWB Spacings
- Electrochemical Migration on Lead-free Printed Circuit Boards with No-Clean Flux Technology
- Reliability Assessment and Modeling of Clinched Insertion Interconnects
- Calibration of Virtual Qualification Model for Leaded Packages with Lead-free Solder Materials
- Effects of Manufacturing Variables on Quality and Durability of Lead Free Solder Joints Continuation of C04-26
- Accelerated Qualification of SAC Assembly: Combined Temperature Cycling & Vibration
- Reliability of SnAgCu Solder for High Temperature/High Power Assemblies
- Experiments to Validate calcePWA Vibration Model Pb/Sn & Sn/Ag/Cu
- Virtual Qualification of Pb-free Power Electronic Assemblies
- Effect of Temperature Cycle on the Durability Lead Free Interconnects Sn-Ag-Cu and Sn-Ag ¨C Continued
- Durability of Reworked Pb-free and Mixed Pb-free/SnPb Solders Interconnects
- Tin Whisker Risk Metric and Mitigation Strategies for Electronic Assemblies
- Characterization of Moisture Absorption and Desorption FBGA Package in Storage and Lead-Free Reflow Soldering Conditions
- Robustness of Ceramic Capacitors Assembled with Pb-Free Solder
- Corrosion of Eutectic and Lead-Free Solder
- Reliable Large-Area Pb-free Interconnects for Photovoltaic Cells
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Lead Free Projects
CALCE Mixed SolderLead-free Study 2006-2007
CALCE Long-term Lead-free Study 2004-2006
CALCE Electronic Products and Systems
Consortium
One of the major efforts of CALCE is
the CALCE Electronic Products and Systems Consortium, a successful
international industry-government-academic partnership, sponsored by
over 100 major international organizations from all sectors of the
electronics industry. Consortium research projects are performed on
an annual basis and are developed in collaboration with the
Consortium members. For more information or to access a complete
list of current projects click here. Recent Consortium projects of
particular interest to the automotive industry are the
following:
2014 Research Projects
2013 Research Projects
2012 Research Projects
2011 Research Projects
2010 Research Projects
2009 Research Projects
2008 Research Projects
2007 Research Projects
2006 Research Projects
2005 Research Projects