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Dr. Michael Osterman recieves The John Wagnon Technical Achievement Award at IMAPS 2013
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On October 1, 2013, Dr. Michael Osterman received the prestigious John A. Wagnon Technical Achievement at the International Microelectronics Assembly and Packaging Society's 46th International Symposium on Microelectronics in Orlando, Florida. The John A. Wagnon Technical Achievement Award is given to a member of the Society who, in the opinion of the John A. Wagnon Technical Achievement Award Selection Committee, has made outstanding technical contributions related to microelectronics technology. The award may be given for a specific accomplishment, for a number of accomplishments over a period of years, or for general overall contributions to the microelectronics industry. The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions bringing together the entire microelectronics supply chain.
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The Center for Advanced Life Cycle Engineering (CALCE), the largest electronic products and systems research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products, and systems.
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