Workshop on Testing Lead-free Electronic Assemblies (2009)



April 14, 2009

Kimm Engineering Building
University of Maryland
College Park, 20742

The presentations linked under this web page have been provided to CALCE and posted without objection from the presenters. The material is copyrighted to the presenter and their respective organizations. You are encouraged to contact the presenter with regards to questions related to the material found here in.

CALCE EPS Consortium members have access to the full presentations

April 14, 2009 (Tuesday)


Session I
Welcome / Introduction
Michael Osterman, CALCE
The Need for a Standard Approach for Testing of Lead-free Assemblies
Anthony J. Rafanelli, Raytheon
Physics-of-Failure (PoF) Based Accelerated Stress Testing
Abhijit Dasgupta, CALCE
Post Assembly Testing of Lead Free Assemblies
Robert Farrell, Benchmark
Sesion II
Reliable Solder Identification by X-ray Fluorescence Spectroscopy
Gary Efronson, Fischer Technology
Lead-free Reflow Effects on PCB Material Properties
Bhanu Sood, CALCE
Ball Shear Test and Cold Bump Test of Ball Grid Array Package
Lei Nie, CALCE
SIR and Electrochemical Testing
Michael Azarian, CALCE
Session III
Isothermal Aging Impact on Solder Interconnect Durability
Preeti Chauhan , CALCE
Temperature Cycle Testing and Acceleration Factors for Lead-free Assemblies
Michael Osterman, CALCE
High-Cycle Fatigue Testing of Lead-free vs. Sn-Pb Solder Joints
Nathan Barry, Aero Engine Controls
Vibration Testing of Lead-free Assemblies
M. Al-Bassyiouni, CALCE
Session IV
Torsion Testing of Electronic Assemblies
Vikram Srinivas, CALCE
Drop Testing for Lead-free Assemblies
Abhijit Dasgupta, CALCE
CALCE Tin Whisker Growth Tests
Lyudmyla Panashchenko , CALCE

Content Disclaimer

The information contained in this packet is designed to be accurate and authoritative in regards to the subject matter covered. However, it is provided with the understanding that the provider is not engaged in rendering legal, accounting, engineering, or other professional services. It is intended to be used for educational purposes only. Individual presenters, their respective organizations and Center for Advanced Life Cycle Engineering (CALCE) disclaim any responsibility or liability for this material and are not responsible for the use of this information outside of its educational purpose.

Copyright Notice

The information contained within this packet has been compiled by the University of Maryland, CALCE

Replication rights of all information is retained by individual presenters, their respective organizations and CALCE.