CALCE Lead(Pb)-Free Forum Meeting

CONCERNS OF OEMs ON THE EFFECTS OF LEAD-FREE TECHNOLOGY ON HIGH-REL PRODUCTS AND SYSTEMS

October 10, 2002
Grand Ball Room, Stamp Student Union
University of Maryland
College Park, MD

Overview: The University of Maryland Computer-Aided Life Cycle Engineering (CALCE) Electronic Products and Systems Consortium (EPSC) is sponsoring a forum on issues regarding lead-free interconnection technologies. The forum is supported by the membership of the consortium. The objective of the forum is to provide insight as into the state of various interconnection technologies and ancillary technologies such as surface finishes. Information, gathered from this meeting, will aid the consortium's efforts in producing roadmap to address industry concerns regarding effects of Lead (Pb)-Free technologies in high reliability products and systems.

Agenda

8:00 am Welcome - M. Osterman (CALCE)

Industry Perspective - Anthony J Rafanelli (Raytheon)
Drivers and Issues in Adopting Lead-Free - Richard Ciocci (Penn State)
Technology Assessment of Lead Free Electronics - Carol Handwerker (NIST)
Lead Free Solder - Dave Suraski (AIM)

Break

Tin Whisker Phenomenon - D. Langhoff (Raytheon)
NIST Tin Whisker Efforts - M. Williams (NIST)
NEMI Tin Whisker Efforts - M. Williams (NIST)
Pb-free Finishes for Components - Other than Matte Sn - D. Abbott (TI)

Lunch

Plating Solutions for Whisker Free Finishes - C. Xu (Cookson)
Managing Lead and Lead-Free Transition in Electronic Connectors - S. Lal (FCI USA)
Results of a Matte Tin Finish Study - Y. Zhang (Technic)
Plating Consultant Perspective - B. Hom (Independent Consultant)

Break

Tin Whisker Work at GSFC/NASA - H. Leidecker (NASA)
CALCE Lead Free Efforts - A. Dasgupta (CALCE)
Panel Discussion - A. Rafanelli and A. Dasgupta