Counterfeit Electronic Parts & Electronic Supply Chain Symposium

November 19-21, 2013

Town & Country Resort,
San Diego, CA

Technical Program
Program Chair: Dr. Diganta Das, CALCE (

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Tuesday, November 19
Session 1 - Supply Chain Management
Opening Remarks

Diganta Das, Ph.D., CALCE - University of Maryland
How the Department of Homeland Security Defends Our Country Against Counterfeited Goods

Hector Perea, Immigration and Customs Enforcement
An Overview of Historical Trends and a New Manner of Counterfeiting

Mark Snider, ERAI
Session 2 - OCMs and Franchised Distributors
The Authorized Channel's Response to Counterfeiting

Robin B. Gray, Jr., ECIA
Fraudulent/Counterfeit Electronic Parts: Avoidance, Detection, Mitigation, and Disposition, Authorized/Franchised Distribution

Chuck Amsden, Jr., Mouser
Winning the Battle Against ©unterfeit Semiconductor Products

Ron Davis, Qualcomm
Anti-Counterfeiting Efforts

Dustin Todd, Semiconductor Industry Association
Session 3 - Independent Distributors
Counterfeit Electronic Components from a Test Lab Perspective

Dave Loaney, Premier
Holistic Supply Chain Security

Jason Jowers, Velocity Electronics
Independent Distribution's Responsibility - Assess and Authenticate the Components

Scott McKee, 4Star
Session 4 - Inspection Methods and Tools
Review of US Export Control Laws
A Guide To Export Enforcement (Document distributed by ICE/DHS)

Joshua Bass, Immigration and Customs Enforcement
External Packaging Evaluation for Counterfeit Risk Detection

Bhanu Sood, CALCE - UMD
Inspection Qualification and Certification Tools: Meeting Industry Expectations

Debra Eggeman, IDEA
Wednesday, November 20th
Session 5 - Legal and Technology Solutions
10 Ways to Find Counterfeit Components Using X-rays

Bill Cardoso, Creative Electron
Sample Preparation for Internal Evaluation

Erik Jordan, Nisene
Ceramic Taggants for Authentication or Provenance Marking of Electronic Components

Brent McLaws, DataDot Technology
Signature DNA Marking

Janice Meraglia, Applied DNA Sciences
Session 6 - Technology Solutions
Low Cost, Real Time Authentication of Individual Legacy Components

Dr. Richard McDermott, SignaKey LLC
Utilization of a PUF to Authenticate and Track a Product

Philippe Mathevon, Advanced Track & Trace
Outer ESD Packaging Container Issues

Bob Vermillion, RMV Technology Group
Session 7 - In-built Authentication
Non-Invasive Optical Analysis Technology, DTEK

Skylar Gauss, Covisus

Mike Solis, The Boeing Company
Material Based Authentication

Diganta Das, Ph.D., CALCE, University of Maryland
Session 8 - Panel Discussion

Introduction to SAE AS6171

AS6171 -Method I - Techniques for Suspect/Fraudulent /Counterfeit EEE Part Detection by External Visual Inspection

Status of AS6171

Detection by Delid/Decapsulation Physical Analysis Methods

Method II: X - Ray Fluorescence (XRF)

Bill Cardoso, Ph.D., Creative Electron

Dave Loaney, Premier

Sultan Lilani, Integra

Erik Jordan, Nisene

Bhanu Sood , CALCE

Are We at the End of the Counterfeit Electronics Concerns?
Diganta Das, Ph.D., CALCE - UMD

Thursday, November 21 (Workshop)
Counterfeit Part Avoidance and Detection

Diganta Das, Ph.D., CALCE - UMD
Bhanu Sood , CALCE

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