Symposium for RoHS Impact on Rework/Repair/Reprocessing (2007)

September 11, 2007

The Samuel Riggs IV Alumni Center University of Maryland College Park, MD 20742

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Welcome and Introduction Michael Osterman, CALCE

A Robotic Solder Dip Process Proven for Use with a Range of Part Types Charlie Minter, BMP

Hot Solder Dip and Related Risks Russ Winslow, Six Sigma

Requirements for Using Solder Dip to Replace the Finish on Electronic Components Anduin Touw, Boeing

Evaluation of Solder Dipped Parts Diganta Das, CALCE

Framework for Retinning and Reballing - Pb-free to SnPb David Cavanaugh, Benchmark

IMC Characteristics of Pb-free Components Reballed with Sn-Pb Minerva Cruz, San Jose State University; Russ Winslow- Six Sigma; Guna S. Selvaduray, San Jose State University

Evaluating "Reverse Compatibility" of Solder Joints William Russell, Raytheon and Denny Fritz, SAIC

Repair and Rework Handbook Tim Kalt, WPAFB

NASA DoD Lead-free Solder Project Dave Hillman, Rockwell Collins

Low Melting Solder Alloy for Rework Polina Snugovsky, Celestica

Successful Pb-free Rework of Through Hole Components on a Large Printed Circuit Board Bob Farrell, Benchmark

Shear Strength of Hand Soldered Components Using Mixed SnPb and Pb-Free Alloys Matt O'Keefe and Richard Colfax, University of Missouri - Rolla

Solder Interconnect Durability of Reworked PBGA and Review of Current CALCE Rework/Reprocessing Research Activities Michael Osterman, CALCE