CALCE/IPC Joint JISSO Forum on Reliability of Electronics

May 24-25, 2011
Room 1202 Martin Hall University of Maryland
College Park, MD

CALCE and IPC sponsored a technical seminar from May 24-25, 2011 at the University of Marylands College Park Campus. This seminar is intended to provide attendees with an interactive forum to discuss the latest concerns, trends and technologies in electronics that impact product reliability. CALCE, IPC and Members of the JISSO International Council, will speak on embedded technologies, batteries, environmental regulations, counterfeit avoidance, test and simulation methods, as well as the emerging field of prognostics.

Presentations provided a snapshot of both integrated electronics development and manufacturing, and receive valuable input on technologies that will impact the electronics industry over the next 10 years. If you want to gain a comprehensive understanding of the key issues in electronic interconnections, this seminar is a must.

About the organizers

The purpose of the Jisso International Council is to facilitate, coordinate, and promote the orderly implementation of advanced electronic packaging and other advanced technologies by standardization and other means. The Council is supported by three main regional groups in each of three global hemispheres. These are the Jisso Japan Council (sponsored by JEITA, JPCA), the Jisso North American Council (sponsored by IPC, JEDEC, and iNEMI), and the Jisso European Council (sponsored by the EIPC).

Request Access to JISSO International Forum Proceedings

May 24th Day 1 of the JISSO International Forum (Reliability)

8:00 am Coffee, Refreshments



Jisso Background/Programs

Denny Fritz MacDermid, Inc

CALCE specific programs/results

Michael Osterman, CALCE

Nanotechnology and Assembly

Alan Rae, Tpf Enterprises (invited)

10:00 am Break Martin Building Lobby

3D Semiconductor Package, Assembly and Test Challenges

Vern Solberg, Tessera

Robust laminate materials that are not at their limit of capability

Silvio Bertling, NELCO (invited)

Tin Whiskers Risk and Mitigation Strategies


12:00 pm Lunch

Solderless Interconnect

Joe Fjelstad, Verdant Electronics

Counterfeit Part Detection Methods

Dignata Das, CALCE

Embedded Component Activity in Europe

Michael Weinhold. EIPC

Data Transfer Through Participants in the Supply Chain

J. Messina, NIST

3:00 pm Break - Martin Building Lobby

Environmental Issues and the Electronics Industry

Fern Abrams -IPC

Product Environmental Compliance Legislation How To

Krista Crotty, Alberi EcoTech

Sustainability Concerns In Electronic Production

Carol Handwerker, Purdue University

iNEMI Environmental Initiatives

Bob Pfahl, iNEMI

May 25 Day 2 of the JISSO International Forum (Reliability)

8:00 am Morning Coffee Martin Building Lobby

Reliability overview

Jack Fisher

Collision of Quality and Reliability Requirements

Bill Dieffenbacher, BAE

Reliability of Embedded Planar Capacitors

Mohammad Alam, CALCE

Reliability of Lithium Ion Batteries

Nick Williard, CALCE

10:00 am Break

PWB Stress Testing- Current Status

Mark Northrup, IEC Electroncis

Assembly Stress Testing

Abhijit Dasgupta, CALCE

Prognostics and Health Management: Case Studies

Sony Mathew- CALCE



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