May 24-25, 2011
Room 1202 Martin Hall
University of Maryland
College Park, MD
CALCE and IPC
sponsored a technical seminar from May 24-25, 2011 at the University
of Maryland’s College Park Campus. This seminar is intended to provide
attendees with an interactive forum to discuss the latest concerns, trends
and technologies in electronics that impact product reliability. CALCE, IPC
and Members of the JISSO International Council,
will speak on embedded technologies, batteries, environmental regulations,
counterfeit avoidance, test and simulation methods, as well as the emerging
field of prognostics.
Presentations provided a snapshot of both integrated electronics
development and manufacturing, and receive valuable input on technologies
that
will impact the electronics industry over the next 10 years. If you want to
gain a comprehensive understanding of the key issues in electronic interconnections,
this seminar is a must.
About the organizers
The purpose of the Jisso
International Council is to facilitate,
coordinate, and promote the orderly implementation of advanced electronic
packaging
and other advanced technologies by standardization and other means. The Council
is supported by three main regional groups in each of three global hemispheres.
These are the Jisso Japan Council (sponsored by JEITA, JPCA), the Jisso North
American Council (sponsored by IPC, JEDEC, and iNEMI), and the Jisso
European Council (sponsored by the EIPC).
Request Access to JISSO International Forum Proceedings
May
24th – Day 1 of the JISSO International Forum (Reliability) |
8:00 am Coffee,
Refreshments |
|
Welcome |
CALCE |
Jisso Background/Programs
|
Denny Fritz
– MacDermid, Inc |
CALCE specific programs/results
|
Michael Osterman,
CALCE |
Nanotechnology and Assembly
|
Alan Rae,
Tpf Enterprises (invited) |
10:00
am Break – Martin Building Lobby |
3D Semiconductor Package,
Assembly and Test Challenges |
Vern Solberg,
Tessera |
Robust laminate materials
that are not at their limit of capability |
Silvio Bertling,
NELCO (invited) |
Tin Whiskers Risk and
Mitigation Strategies |
S. Han, CALCE
|
12:00
pm Lunch – |
Solderless Interconnect
|
Joe Fjelstad,
Verdant Electronics |
Counterfeit Part Detection
Methods |
Dignata Das,
CALCE |
Embedded Component Activity in Europe
|
Michael Weinhold.
EIPC |
Data Transfer Through
Participants in the Supply Chain |
J. Messina,
NIST |
3:00 pm Break -
Martin Building
Lobby |
Environmental Issues and the
Electronics Industry
|
Fern Abrams
-IPC |
Product Environmental Compliance
Legislation How To
|
Krista Crotty,
Alberi EcoTech |
Sustainability Concerns
In Electronic Production |
Carol Handwerker,
Purdue University |
iNEMI Environmental Initiatives
|
Bob Pfahl, iNEMI |
May
25 – Day 2 of the JISSO International Forum (Reliability) |
8:00 am Morning
Coffee – Martin Building Lobby |
Reliability
overview |
Jack Fisher |
Collision
of Quality and Reliability Requirements |
Bill Dieffenbacher, BAE
– |
Reliability of Embedded Planar Capacitors
|
Mohammad Alam, CALCE
|
Reliability
of Lithium Ion Batteries |
Nick Williard, CALCE |
10:00
am Break |
PWB Stress
Testing- Current Status |
Mark Northrup, IEC Electroncis
|
Assembly
Stress Testing |
Abhijit Dasgupta, CALCE |
Prognostics and Health Management: Case Studies
|
Sony Mathew- CALCE
|
Noon-Adjourn
|
|
