On October 14, 2026, the Center for Advanced Life Cycle Engineering held its bi-annual Reliability Science symposium. This meeting was held in a hybrid inperson and Zoom format. The meeting included an overview of CALCE research activities, followed by several detailed research project presentations. Please note that electronic copies of presentations and recordings of the event are available only to CALCE members through a CALCE Web Account.

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October 14, 2026 (Wednesday)

9:00 am - Opening Presentations I CALCE Overview

9:30 am - Session I

	Ripple Current Testing of Multilayer Ceramic Capacitors (MLCCs) for Correlation with Selection Criteria (Members' Only)
	Microstructural Feature Analysis of Multilayer Ceramic Capacitors for Reliability Assessment (Members' Only)
	Modeling and Physical Analysis of Lubrication in Lightly Loaded Contacts Undergoing Fretting (Members' Only)

10:45 am - Session II

	HDI Laminate Reliability Concerns (Members' Only)
	Feature Size-based Dimensional Data for Component Reliability Assessment (Members' Only)
	Rapid Assessment of Electronic Assemblies Using Side-Channel Power Modulation Analysis (Members' Only)
	Online Diagnostics and Predictive Maintenance for Electronic Products (Members' Only)

1:15 pm - Session III

	Reliability of Low Temperature Solder Interconnects (Members' Only)
	Reliability of Lead-free High-Performance Solder Interconnects (Members' Only)
	Effect of Aging and Recrystallization on Performance of Oligocrystalline SAC Solder Joints
	Coating Durability in Electronic Products (Members' Only)

3:00 pm - Session IV

	Radiation Hardness of Microelectronics through SCALE (Members' Only)
	Strain Based Measures for Identifying Precursor for Thermal Runaway (Members' Only)
	Internal Shorting Conditions Required for Thermal Runaway (Members' Only)
	Physics-of-Failure-Based Reliability Prediction of LED Devices for Defect Propagation and Comparison with Handbook (Members' Only)
	Availability-Aware Design Methodology for Edge Data Center Thermal Management Systems (Members' Only)
	Analysis of Chinese AI Patents (Presentation not provided)