On October 14, 2026, the Center for Advanced Life Cycle Engineering will hold its bi-annual Reliability Science symposium. This meeting will be held in a hybrid inperson and Zoom format. The meeting will include an overview of CALCE research activities, followed by several detailed research project presentations. The meeting will be open to all CALCE members. Non-CALCE organizations interested in attending may also request attendance. Please note that electronic copies of presentations and recordings of the event are available only to CALCE members through a CALCE Web Account.

Request Attendance

October 14, 2026 (Wednesday)

9:00 am - Opening Presentations I CALCE Overview

9:30 am - Session I

View Presentations and Provide Feedback - Session 1

	Ripple Current Testing of Multilayer Ceramic Capacitors (MLCCs) for Correlation with Selection Criteria (Members' Only)
	Microstructural Feature Analysis of Multilayer Ceramic Capacitors for Reliability Assessment (Members' Only)
	Modeling and Physical Analysis of Lubrication in Lightly Loaded Contacts Undergoing Fretting (Members' Only)

10:45 am - Session II

View Presentations and Provide Feedback - Session 2

	HDI Laminate Reliability Concerns (Members' Only)
	Feature Size-based Dimensional Data for Component Reliability Assessment (Members' Only)
	Rapid Assessment of Electronic Assemblies Using Side-Channel Power Modulation Analysis (Members' Only)
	Online Diagnostics and Predictive Maintenance for Electronic Products (Members' Only)

1:15 pm - Session III

View Presentations and Provide Feedback - Session 3

	Reliability of Low Temperature Solder Interconnects (Members' Only)
	Reliability of Lead-free High-Performance Solder Interconnects (Members' Only)
	Effect of Aging and Recrystallization on Performance of Oligocrystalline SAC Solder Joints (Members' Only)
	Coating Durability in Electronic Products (Members' Only)

3:00 pm - Session IV

View Presentations and Provide Feedback - Session 4

	Radiation Hardness of Microelectronics through SCALE (Members' Only)
	Strain Based Measures for Identifying Precursor for Thermal Runaway (Members' Only)
	Internal Shorting Conditions Required for Thermal Runaway (Members' Only)
	Comparative Analysis of Reliability Prediction Methods for Telecommunication Systems (Members' Only)
	Analysis of AI Patents (Members' Only)