C26-19 Ripple Current Testing of Multilayer Ceramic Capacitors (MLCCs) for Correlation with Selection Criteria High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C26-20 Rapid Assessment of Electronic Assemblies Using Side-Channel Power Modulation Analysis High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C26-22 Modeling and Physical Analysis of Lubrication in Lightly Loaded Contacts Undergoing Fretting High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C26-11 HDI Laminate Reliability Concerns High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C26-12 Feature Size-based Dimensional Data for Component Reliability Assessment High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C26-07 Thermal Cycle Reliability Models for Lead-free High-Performance Solder Interconnects and Wafer Level Package Solder Interconnect Tests High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C26-08 Reliability of Low-Temperature Solder Interconnects High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C26-09 Tin Whisker Mitigation and Risk High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C26-03: Microstructure-sensitive Reliability Assessment for PHM Digital-Twins of HI Interconnects High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C26-26 Coating Durability in Electronic Products High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions: