CALCE EPSC FY2025 Project Feedback Form


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P25-H1: Development of Advanced Board Level Reliability Prediction Model for Power Devices (Phase II)
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-A1: Coating Durability in Electronic Products
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-A2: Effect of Aging and Recrystallization on Performance of Oligocrystalline SAC Solder Joints
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-M1: 3D Printed Power Packaging for Harsh Environment Electronics
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-M2: Machine Learning for Robust and Reliable Power Electronic Systems
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-M3: Reliability of Microchannel Coolers
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-P1: Strain Sensors for Early Detection of Gas Generation from Thermal Runaway
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-O1: Reliability of Lead-free High-Performance Solder Interconnects
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-O2: Reliability of Low Temperature Solder Interconnects
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-Z01: Validation of Selection Criteria for Use of Multilayer Ceramic Capacitors (MLCCs) with Ripple Current
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-Z02: Fretting of Electrical Contacts Finished with Electroless Gold
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-Z03: Validation of a PHM Methodology for Printed Circuit Board (PCB) Assemblies
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-Z04: Rapid Assessment of Electronic Products Using Side-Channel Power Modulation Analysis
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-D01:Uprating Tools for Selected Component Types
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-D02:Simulation Platform for Component Reliability Assessment
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions:
P25-D03:Guidelines for Storage of Printed Board Assemblies and Electronic Equipment
High Interest
Interest
No Interest
Abstain (i.e. not qualified to comment)

Comments and Suggestions: