C25-19 Validation of Selection Criteria for Use of Multilayer Ceramic Capacitors (MLCCs) with Ripple Current High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C25-20 Rapid Assessment of Electronic Products Using Side-Channel Power Modulation Analysis High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C25-22 Fretting of Electrical Contacts Finished with Electroless Gold High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C25-11 Guidelines for Storage of Printed Board Assemblies and Electronic Equipment High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C25-03 Effect of Aging and Recrystallization on Performance of Oligocrystalline SAC Solder Joints High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C25-26 Coating Durability in Electronic Products High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C25-06 Physics of Failure Based Electronic Product Design Review High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C25-07 Reliability of Lead-free High-Performance Solder Interconnects High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions:

C25-08 Reliability of Low Temperature Solder Interconnects High Interest Interest No Interest Abstain (i.e. not qualified to comment) Comments and Suggestions: