Reliability Science Symposium Feedback Form


Name/Company - Optional:

Solder Performance and Reliability Assurance Project
Keynote Speaker: Dr. Michael Osterman

Interest In Topic (5 being excellent): 1 2 3 4 5

Quality of Presentation (5 being excellent):: 1 2 3 4 5

Comments and Suggestions:
Fatigue under Multiaxial Cyclic Creep and Plasticity in Oligocrystalline SAC Solder Joints (Members' Only)

Interest In Topic (5 being excellent): 1 2 3 4 5

Quality of Presentation (5 being excellent):: 1 2 3 4 5

Comments and Suggestions:
Reliability of 3rd Generation Lead-free Solder Interconnects (Members' Only)

Interest In Topic (5 being excellent): 1 2 3 4 5

Quality of Presentation (5 being excellent):: 1 2 3 4 5

Comments and Suggestions:
Reliability of Low Temperature Solder Interconnects (Members' Only)

Interest In Topic (5 being excellent): 1 2 3 4 5

Quality of Presentation (5 being excellent):: 1 2 3 4 5

Comments and Suggestions:
Board Level Reliability Assessment of Bi-based Hybrid Low Melting Solder as a Function of Bi Diffusion (Members' Only)

Interest In Topic (5 being excellent): 1 2 3 4 5

Quality of Presentation (5 being excellent):: 1 2 3 4 5

Comments and Suggestions: