On Tuesday, March 22 and Wednesday March 23, 2022, the Center for Advanced Life Cycle Engineering will conduct its bi-annual Reliability Science symposium and research planning meetings. This meeting will be conducted virtually and will include an overview of CALCE research activities with several detailed research project presentations. The meeting will open to CALCE members and those individuals interested in learning more about CALCE research. The links to register for the event are provided below:

10:00 am - Session I

	CALCE Overview
	Evaluation and Selection of Lubricants for Mechanical Interfaces (Members' Only)
	Derating and Rapid Assessment of Multilayer Ceramic Capacitors (MLCCs) for Use with Ripple Current (Members' Only)
	Long Term Storage Reliability of Hybrid and Polymer Aluminum Electrolytic Capacitors (Members' Only)
	Reliability Challenges of Wide Bandgap and Ultra-Wide Bandgap Semiconductor Electronics in Extreme Environments (Members' Only)
	Development of an Insulated-Gate Bipolar Transistor (IGBT) Testing and Screening Procedure (Members' Only)
	Component Life Assessment Methodology Development (Members' Only)

1:00 pm - Session II

	Enterprise Network Modeling for Counterfeit Part Disruption (Members' Only)
	Effect of Driving Conditions on Accumulated Solder Joint Damage (Members' Only)
	Reliability of Low Temperature and 3rd Generation Solder Interconnects (Members' Only)
	Modeling Solder Interconnect Damage for Complex Temperature Cycles (Members' Only)
	Virtual Testing and Digital Twin Approaches for Response of Grain-scale Solder Interconnects to Multiaxial Loading (Members' Only)
	Paint Durability for Electronic Products (Members' Only)

10:00 am - Student Presentations

	Explainable AI for PHM (Members' Only)
	Reliability and Safety Analysis using Digital Twins (Members' Only)
	Machine Learning and Machine Vision: Applications to Counterfeit Detection (Members' Only)
	Water Ingress Protection Testing and Assessment of Portable Electronics (Members' Only)
	Electrolyte Influence on Lithium Dendrite Formation (Members' Only)
	Are current vibration qualification methods adequate for multiaxial vibration environments ? (Members' Only)
	Creep behavior of micron-scale porous sintered silver features seen in high-temperature interconnects and in 3D printed conductors (Members' Only)
	Durability of 3D printed electronics under extreme drop conditions (Members' Only)
	Additively-fabricated flexible temperature and humidity sensors made from CNT/GO Inks (Members' Only)
	Compound failure modes in SMT interconnects under combined vibration and temperature cycling (Members' Only)
	Failure Manifestation in Power Electronics (Members' Only)

1:00 pm - FY23 Research Proposals

Project Development Process