Reliability Science Symposium Feedback Form
Name/Company
:
Virtual Testing and Digital Twin Approaches for Response of Grain-scale Solder Interconnects to Multiaxial Loading
Interest In Topic (5 being excellent):
1
2
3
4
5
Quality of Presentation (5 being excellent)::
1
2
3
4
5
Comments and Suggestions:
Durability of Solder Interconnects and Copper Traces under Vibration & Temperature Cycling loads
Interest In Topic (5 being excellent):
1
2
3
4
5
Quality of Presentation (5 being excellent)::
1
2
3
4
5
Comments and Suggestions:
Mechanical Properties of Sintered Silver using Indentation Methods
Interest In Topic (5 being excellent):
1
2
3
4
5
Quality of Presentation (5 being excellent)::
1
2
3
4
5
Comments and Suggestions:
Vibration Durability of Electronic Assemblies Exposed to Multiaxial Excitation
Interest In Topic (5 being excellent):
1
2
3
4
5
Quality of Presentation (5 being excellent)::
1
2
3
4
5
Comments and Suggestions:
