Reliability Science Symposium Feedback Form
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C22-02 Effect of Driving Conditions on Accumulated Solder Joint Damage
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C22-19 Derating and Rapid Assessment of Multilayer Ceramic Capacitors (MLCCs) for Use with Ripple Current
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C22-22 Evaluation and Selection of Lubricants for Mechanical Interfaces
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C22-12 Development of Application-Specific Insulated Gate Bipolar Transistor (IGBT) Qualification Procedure
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C22-14 Component Life Assessment Methodology Development
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C22-03 Fatigue under Multiaxial Cyclic Creep in Oligocrystalline SAC Solder Joints
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C22-15 Paint Durability for Electronic Products
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C22-08 Reliability of Low Temperature (e.g. BiSn) Solder Interconnects
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C22-07 Reliability of Third Generation Solder Interconnects
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